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Dive into the research topics where Giovanni Graziosi is active.

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Featured researches published by Giovanni Graziosi.


design, automation, and test in europe | 2009

EMC-aware design on a microcontroller for automotive applications

Patrice Joubert Doriol; Yamarita Villavicencio; Cristiano Forzan; Mario Rotigni; Giovanni Graziosi; Davide Pandini

In modern digital ICs, the increasing demand for performance and throughput requires operating frequencies of hundreds of megahertz, and in several cases exceeding the gigahertz range. Following the technology scaling trends, this request will continue to rise, thus increasing the electromagnetic interference (EMI) generated by electronic systems. The enforcement of strict governmental regulations and international standards, mainly (but not only) in the automotive domain, are driving new efforts towards design solutions for electromagnetic compatibility (EMC). Hence, EMC/EMI is rapidly becoming a major concern for high-speed circuit and package designers. The on-chip power rail noise is one of the most detrimental sources of electromagnetic (EM) conducted emissions, since it propagates to the board through the power and ground I/O pads. In this work we investigate the impact of power rail noise on EMI, and we show that by limiting this noise source it is possible to drastically reduce the conducted emissions. Furthermore, we present a transistor-level lumped-element simulation model of the system power distribution network (PDN) that allows chip, package, and board designers to asses the power integrity and predict the conducted emissions at critical chip I/O pads. The experimental results obtained on an industrial microcontroller for automotive applications demonstrate the effectiveness of our approach.


Archive | 2012

INTEGRATED INDUCTOR DEVICE WITH HIGH INDUCTANCE, FOR EXAMPLE FOR USE AS AN ANTENNA IN A RADIOFREQUENCY IDENTIFICATION SYSTEM

Fulvio Vittorio Fontana; Giovanni Graziosi


Archive | 2006

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES

Federico Giovanni Ziglioli; Giovanni Graziosi; Mario Francesco Cortese


Archive | 2015

SHIELDED ENCAPSULATING STRUCTURE AND MANUFACTURING METHOD THEREOF

Fulvio Vittorio Fontana; Giovanni Graziosi; Alex Gritti


european microelectronics and packaging conference | 2013

Ball Grid Array package for automotive application: Strong link between design and 3D modeling

Giovanni Graziosi; Cristina Somma; Arianna Morelli; Claudio Maria Villa; Patrice Joubert Doriol; Laurent Marechal; Sebastien Gallois-Garreignot


Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) | 2010

A High Performance and Cost Effective Molded Array Package Substrate

Philip E. Rogren; Pierangelo Magni; Maura Mazzola; Mark Shaw; Giovanni Graziosi; Claudio Maria Villa


european microelectronics and packaging conference | 2009

WPLGA: New package family for medium pin count with design flexibility

Pierangelo Magni; Giovanni Graziosi; Claudio-Maria Villa; Roberto Tiziani; Rodolfo Gacusan


european microelectronics and packaging conference | 2009

Advanced modeling techniques for system-level power integrity and EMC analysis

Giovanni Graziosi; Patrice Joubert Doriol; Yamarita Villavicencio; Cristiano Forzan; Mario Rotigni; Davide Pandini


Archive | 2009

Semiconductor package substrate

Federico Giovanni Ziglioli; Giovanni Graziosi; Mario Francesco Cortese


ieee workshop on signal and power integrity | 2018

Optimization of on-package decoupling capacitors considering system variables

Aurora Sanna; Giovanni Graziosi

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