Mario Paparo

A 56-mW 23-mm/sup 2/ single-chip 180-nm CMOS GPS receiver with 27.2-mW 4.1-mm/sup 2/ radio

A 56-mW 23-mm/sup 2/ GPS receiver with CPU-DSP-64 kRAM-256 kROM and a 27.2-mW 4.1-mm/sup 2/ radio has been integrated in a 180-nm CMOS process. The SoC GPS receiver, connected to an active antenna, provides latitude, longitude, height with 3-m rms precision with no need of external host processor in a [-40, 105]/spl deg/C temperature range. The radio draws 17 mA from a 1.6-1.8-V voltage supply, takes 11 pins of a VFQFPN68 package, and needs just a few passives for input match and a crystal for the reference oscillator. Measured radio performances are NF=4.8 dB, Gp=92 dB, image rejection > 30 dB, -112 dBc/Hz phase noise @ 1 MHz offset from carrier. Though GPS radio linearity and ruggedness have been made compatible with the co-existence of a microprocessor, radio silicon area and power consumption is comparable to state-of-the-art stand-alone GPS radio. The one reported here is the first ever single-chip GPS receiver requiring no external host to achieve satellite tracking and position fix with a total die area of 23 mm/sup 2/ and 56-mW power consumption.

Balanced SiGe PA Module for Multi-Band and Multi-Mode Cellular-Phone Applications

In this paper, the integration of a MM (GSM/EDGE/WCDMA) MB (850/900MHz, 1800/1900/2100MHz) 50 Omega-matched isolator-less flip-chip PAs, capable of envelope and power tracking operation, is discussed. The PAs are integrated in a 0.25 mum SiGe technology and are soldered on a 4-layer substrate. The system is hosted in a 6 x 8 mm2 plastic module.

Power management systems on silicon for portable equipment

In an application field where size, weight and battery duration often make the most relevant differentiation factors for the consumer, the paper gives a brief market overview of portable equipment, highlighting the integrated power management feature trends tied to the batteries, LCD technology evolution and increasing distributed power demand. Some examples of power management systems and battery charger topologies, underlining the possibilities offered by integrated mixed-mode technology evolution, are discussed. Finally, new possibilities offered by innovative packaging technologies that will help in further cost and size optimization are analyzed.

Estimation of in-cylinder pressure using spark plug discharge current measurements

In-cylinder pressure of spark ignition engines is correlated with several variables of the compression, injection, and ignition processes. Therefore, by monitoring the pressure of each cylinder we can improve the electronic engine supervision and control in terms of fast response and accuracy, thus enabling online diagnosis and overall efficiency improvement. However, the pressure measurement methods proposed until now have not been generally accepted at the production level due to their cost and/or complexity. In this paper we describe a novel approach that derives the pressure information from the measurement of the ordinary spark plug discharge current. In this manner, the mechanical part of the engine does not require substantial modification. To demonstrate the viability of the proposed technique, a prototype measurement system was set up and tested. Preliminary experimental data show that pressure in stationary conditions can be estimated with an error lower than 5% for pressure above 3 atmospheres.

RF design and technology supporting Active Safety in automotive applications

As safety is already a competitive factor in the growth of automotive applied technologies, the Active Safety represents its most advanced aspect which is driving IC design and technology development. Automotive Active Safety nowadays exploits a wide range of sensors and technologies, spanning from the already consolidated ABS, ESP, etc., to the ultrasonic, the Real Time Image Processing up to the Radar Systems.