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Featured researches published by Martin Gall.


international solid-state circuits conference | 1998

A 220-mm/sup 2/, four- and eight-bank, 256-Mb SDRAM with single-sided stitched WL architecture

Toshiaki Kirihata; Martin Gall; K. Hosokawa; Jean-Marc Dortu; Hung K. Wong; K.-P. Pfefferl; B. Ji; Oliver Weinfurtner; John K. DeBrosse; Hartmund Terletzki; M. Selz; W. Ellis; Matthew R. Wordeman; Oliver Kiehl

A 220-mm/sup 2/, 256-Mb SDRAM has been fabricated in fully planarized 0.22-/spl mu/m CMOS technology with buried strap trench cell. The single-sided stitched word-line (WL) architecture employs asymmetric block activation and shared row decoders to realize 86.7% cell/chip-length efficiency (57.3% cell/chip efficiency). A staggered WL driver arrangement makes it possible to build the drivers on a 0.484-/spl mu/m WL pitch in limited space. An intraunit address increment pipeline scheme having two logical 8-Mb arrays within one physical 16-Mb unit results in a burst frequency up to 200 MHz for single data rate, while allowing four- and eight-bank organizations. A data rate of 270 Mbits/s was confirmed with a 135-MHz frequency doubling test mode. Single-ended addresses and a single ended read-write-drive bus reduce the ICC/sub 4/ current to /spl sim/90 mA for 100-MHz seamless burst operation. A detailed shmoo analysis demonstrates address-access time of 13.5 ns and clock-access time of 5 ns. This design also uses a selectable row domain and divided column redundancy scheme that repairs up to /spl sim/1400 faults/chip with only 8% chip overhead.


Archive | 2002

Arrangement of memory chip housings on a DIMM circuit board

Martin Gall; Simon Muff; Wolfgang Hoppe


Archive | 2001

Method for masking DQ bits

Martin Gall; Andre Schaefer


Archive | 2002

Circuit board for memory components

Martin Gall; Simon Muff


Archive | 2002

Semiconductor module having a configurable data width of an output bus, and a housing configuration having a semiconductor module

Simon Muff; Martin Gall; Oliver Kiehl


Archive | 2001

Voltage supply for semiconductor memory

Martin Gall; Andre Schaefer


Archive | 2001

Voltage supply for semiconductor memory arrangement

Martin Gall; Andre Schaefer


Archive | 2001

Integrated circuit has high frequency signal connections arranged at center of package to minimize path lengths

Simon Muff; Martin Gall; Andre Schaefer; Georg Braun


Archive | 2001

Semiconductor module e.g. semiconductor memory chips in which one of data connecting pads not used to interchange data, is permanently connected to voltage supply of semiconductor module

Martin Gall; Oliver Kiehl; Simon Muff


Archive | 2001

Halbleiterbaustein mit konfigurierbarer Datenbreite eines Ausgangsbusses und Gehäuseanordnung mit einem Halbleiterbaustein

Martin Gall; Oliver Kiehl; Simon Muff

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