Masahiro Tamaki

Method of dicing semiconductor wafer

Apparatus for electroplating a semiconductor substrate

Method of plating semiconductor wafer and plated semiconductor wafer

Plating apparatus for plating a wafer

Semiconductor device with high aspect ratio via hole including solder repelling coating

Process for dicing a semiconductor wafer having a plated heat sink using a temporary substrate

Method of producing semiconductor device with heat dissipation metal layer and metal projections

Semiconductor device with plated heat sink and partially plated side surfaces

Semiconductor device with heat dissipation metal layer and metal projections

Electrodeposition unit for semiconductor wafer coating