Masanobu Kimura

Electrostatic linear microactuator mechanism for focusing a CCD camera

A newly developed linear electrostatic microactuator mechanism employing a vibrating motion is described. In order to achieve a miniature charge coupled device (CCD) camera with autofocusing and zoom functions, we developed an electrostatic linear microactuator with a large movement range. In miniature CCD cameras, extremely thin electrostatic actuators are needed because the space available for the focusing mechanism is reduced. The moving part (slider) of this actuator is sandwiched between fixed electrodes (stator), is alternately attached and detached to these fixed electrodes, and actuates linearly on a macroscopic level. The fundamental feasibility of this vibrating motion mechanism was first confirmed in experiments. This actuator was then applied to the focusing mechanism of a miniature CCD camera. A microlens was fitted inside the slider and it was possible to adjust the focus by moving the slider (with microlens). The size of the prototype for the focusing mechanism is 3.6/spl times/4.6/spl times/8.0 mm, and a 2-mm movement range is achieved. The minimum driving voltage is 60 V and the maximum velocity is 1.0 min/s.

High-density 3-D packaging technology based on the sidewall interconnection method and its application for CCD micro-camera visual inspection system

High-density three-dimensional (3-D) packaging technology for a charge coupled device (CCD) micro-camera visual inspection system module has been developed by applying high-density interconnection stacked unit modules. The stacked unit modules have fine-pitch flip-chip interconnections within Cu-column-based solder bumps and high-aspect-ratio Cu sidewall footprints for vertical interconnections. Cu-column-based solder bump design and underfill encapsulation resin characteristics were optimized to reduce the strain in the bump so as to achieve fine-pitch flip-chip interconnection with high-reliability. High-aspect-ratio Cu sidewall footprints were realized by the Cu-filled stacked vias at the edge of the substrate. High-precision distribution of sidewall footprints was achieved by laminating the multiple stacked unit substrates simultaneously. The fabricated high-density 3-D packaging module has operated satisfactorily as the CCD imaging data transmission circuit. The technology was confirmed to be effective for incorporating many large scale integrated (LSI) devices of different sizes at far higher packaging density than it is possible to attain using conventional technology. This paper describes the high-density 3-D packaging technology which enables all of the CCD imaging data transmission circuit devices to be packaged into the restricted space of the CCD micro-camera visual inspection system interior.

Stereoscopic video movie camera using 300K pixel IT-CCD sensors

A novel stereoscopic video movie camera, 3D-CAM, has been developed. It incorporates two eyelike microcamera heads using 300K pixel color IT-CCD (interline-transfer charge coupled device) sensors. The 3D-CAM records right and left images alternately through the two camera heads onto a VHS-C video cassette tape. Viewers see these images on a TV monitor through liquid-crystal shutter glasses, whose shutter action is synchronized with the images, so that the right and left images are mixed in the brain to create fine stereoscopic images. To obtain the best 3-D images, many kinds of new technologies have been developed, including: sequential switching of the right and left image signals by field intervals in camera heads; accurate registration according to the CCD geometrical arrangement; relation between the position of the object and right and left camera head distances; and concourse angle between the subject and two camera heads. Fine color stereoscopic images are easily obtained by the 3D-CAM without two video cameras and two VCRs. Many kinds of applications are expected, such as entertainment, robot eyes, manipulators, simulators, and medical use. >

A micro miniaturized CCD color camera utilizing a newly developed CCD packaging technique

A small camera using a CCD (charge coupled device) image sensor has been widely used in various fields. The authors have developed the worlds smallest and highest picture quality CCD color camera to enlarge the camera market. This camera is 7.0 mm in diameter, 47 mm in length, and only 4 g in weight. The driving force to realize the camera was to develop the smallest CCD package. The new CCD package, TOG:TAB (tape automated bonding) on glass, is almost as small as a CCD bare chip with a 1/4-inch size. Furthermore, the TOG package realizes a simple production process and high reliability. >

CCD micro-miniature color camera

A microminiature color camera system with an extremely small camera head utilizing a CCD (computer-controlled display) image sensor is described. The camera system consists of a camera head unit with a camera holder, a camera control unit, and an AC power supply unit. The camera head is connected to the camera control unit by a 4 mm diameter, 2 m long cable. The design used separates the camera head from the control unit, so that it can meet a variety of customer needs or special purposes. Since the output signal from the camera control unit is a standard NTSC signal, it can be easily connected to a standard TV monitor or to an independent video cassette recorder. The camera head (17.5 mm in diameter and 53 mm in length) incorporates a small, wide-angle 7.5 mm focus lens, a 200000 picture element CCD image sensor with color filter array and compact electronic circuits. The design, specifications and applications of the system are discussed.

High-density 3D packaging technology for CCD micro-camera system module

High-density three-dimensional (3D) packaging technology for a CCD micro-camera system module has been developed by applying high-density interconnection stack-unit modules that have fine-pitch flip-chip interconnections within copper-column-based solder bumps and high-aspect-ratio sidewall footprints for vertical interconnections. Copper-column-based solder bump design and underfill encapsulation resin characteristics were optimized to reduce the strain in the bump and to achieve fine-pitch flip-chip interconnection with high reliability. High-aspect-ratio sidewall footprints were realized by the copper-filled stacked vias at the edge of the module substrate. High-precision distribution of sidewall footprints was achieved by laminating the multiple stack-unit substrates simultaneously. The fabricated three-dimensional package has operated satisfactorily as the CCD imaging data transmission circuit module. The technology was confirmed to be effective for incorporating many devices of different sizes at far higher packaging density than it is possible to attain using conventional technology.