Masashi Takenaka | Researchain

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Archive | 1997

Semiconductor device and semiconductor device unit having ball-grid-array type package structure

Taturou Yamashita; Masashi Takenaka

Archive | 1997

Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device

Norio Fukasawa; Toshimi Kawahara; Muneharu Morioka; Mitsunada Osawa; Yasuhiro Shinma; Hirohisa Matsuki; Masanori Onodera; Junichi Kasai; Shigeyuki Maruyama; Masao Sakuma; Yoshimi Suzuki; Masashi Takenaka

Archive | 1997

Semiconductor device and method of forming the device

Michio Sono; Masashi Takenaka; Masanori Yoshimoto; Tsuyoshi Aoki; Ichiro Yamaguchi; Koki Otake

Archive | 1996

Semiconductor device having upper and lower package bodies and manufacturing method thereof

Hiroyuki Mitsue; Masashi Takenaka; Masao Sakuma

Archive | 2003

Semiconductor device having a heat spreader exposed from a seal resin

Sumikazu Hosoyamada; Yoshitsugu Kato; Mitsuo Abe; Kazuto Tsuji; Masaharu Minamizawa; Toshio Hamano; Toshiyuki Honda; Katsuro Hiraiwa; Masashi Takenaka

Archive | 1996

Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device

Toshiyuki Motooka; Syuichirou Takahasi; Tatsuharu Matsuda; Kunio Kodama; Joji Fujimori; Shigeki Harada; Masataka Mizukoshi; Masashi Takenaka; Tatsuro Yamashita

Archive | 1997