Mitsunada Osawa | Researchain

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Archive | 1997

Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device

Norio Fukasawa; Toshimi Kawahara; Muneharu Morioka; Mitsunada Osawa; Yasuhiro Shinma; Hirohisa Matsuki; Masanori Onodera; Junichi Kasai; Shigeyuki Maruyama; Masao Sakuma; Yoshimi Suzuki; Masashi Takenaka

Archive | 1997

Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

Toshimi Kawahara; Sinya Nakaseko; Mitsunada Osawa; Mayumi Osumi; Hiroyuki Ishiguro; Yoshitugu Katoh; Junichi Kasai; Shinichirou Taniguchi; Yuji Sakurai

Archive | 1994

Semiconductor device having resin gate hole through substrate for resin encapsulation

Toshimi Kawahara; Shinya Nakaseko; Mitsunada Osawa; Shinichirou Taniguchi; Mayumi Osumi; Hiroyuki Ishiguro; Yoshitugu Katoh; Junichi Kasai

Archive | 1998

Semiconductor module including a plurality of semiconductor devices detachably

Mitsutaka Sato; Tetsuya Fujisawa; Shigeyuki Maruyama; Junichi Kasai; Toshimi Kawahara; Toshio Hamano; Yoshihiro Kubota; Mitsunada Osawa; Yoshiyuki Yoneda; Kazuto Tsuji; Hirohisa Matsuki

Archive | 1996

Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition

Yukio Takigawa; Shigeaki Yagi; Toshimi Kawahara; Mitsunada Osawa; Hiroyuki Ishiguro; Shinya Nakaseko; Takashi Hozumi; Masaaki Seki

Archive | 1992

Method for wire-bonding an integrated circuit

Akihiro Kubota; Mitsunada Osawa

Archive | 1996

Semiconductor integrated circuit device having stacked wiring and insulating layers

Toshimi Kawahara; Hiroyuki Ishiguro; Mitsunada Osawa; Shinichirou Taniguchi; Mayumi Osumi; Shinya Nakaseko; Yoshitugu Katoh; Junichi Kasai

Archive | 1997

Wiring boards and mounting of semiconductor devices thereon

Norio c; o Fujitsu Limited Fukasawa; Junichi C; O Fujitsu Limited Kasai; Toshimi C; O Fujitsu Limited Kawahara; Shigeyuki c; o Fujitsu Limited Maruyama; Hirohisa c; o Fujitsu Limited Matsuki; Muneharu c; o Fujitsu Limited Morioka; Masanori c; o Fujitsu Limited Onodera; Mitsunada Osawa; Masao C; Yasuhiro c; Yoshimi c; Masashi C; O Fujitsu Limited Takenaka

Archive | 1998

Halbleitermodul mit einer Mehrzahl von abtrennbaren Halbleiterbauteilen

Tetsuya c; o Fujitsu Limited Fujisawa; Toshio c; o Fujitsu Limited Hamano; Junichi C; O Fujitsu Limited Kasai; Toshimi C; O Fujitsu Limited Kawahara; Yoshihiro c; o Fujitsu Limited Kubota; Shigeyuki c; o Fujitsu Limited Maruyama; Hirohisa c; o Fujitsu Limited Matsuki; Mitsunada Osawa; Mitsutaka C; o Fujitsu Limited Sato; Kazuto C; O Fujitsu Limited Tsuji; Yoshiyuki C; O Fujitsu Limited Yoneda

Archive | 1997

Mold for manufacturing semiconductor device

Norio Fukusawa; Junichi Kasai; Toshimi Kawahara; Shigeyuki Maruyama; Hiro Matsuki; Muneharu Morioka; Masanori Onodera; Mitsunada Osawa; Masashi Takenaka

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