Michael Mack

An ultra low power CMOS photonics technology platform for H/S optoelectronic transceivers at less than

We have demonstrated a CMOS Optoelectronic technology platform, using a 650mW 4×10-Gb/s 0.13 μm silicon-on-insulator integrated transceiver chip, co-packaged with an externally modulated laser, to enable high density data interconnects at <

1 per Gbps

1 per Gbps.

25 Gb/s silicon photonic transceivers

We report on the demonstration of an integrated 4×25 Gb/s parallel optical transceiver built in Luxteras CMOS photonics platform, and discuss how we can scale this platform to even higher data rates.

Packaging of silicon photonics systems

We address the effects of packaging on performance, reliability and cost of photonic devices. For silicon photonics we address some specific packaging aspects. Finally we propose an approach for integration of photonics and ASICs.

Scaling CMOS photonics transceivers beyond 100 Gb/s

We report on the performance of an integrated four-channel parallel optical transceiver built in a CMOS photonics process, operating at 28 Gb/s per channel. The optical engine of the transceiver comprises a single silicon die and a hybrid integrated DFB laser. The silicon die contains the all functionalities needed for an optical transceiver: transmitter and receiver optics, electrical driver, receiver and control circuits. We also describe the CMOS photonics platform used to build such transceiver device, which consists of: an optically enabled CMOS process, a photonic device library, and a design infrastructure that is modeled after standard circuit design tools. We discuss how this platform can scale to higher speeds and channel counts.

Advantages of CMOS photonics for future transceiver applications

The advantages of CMOS photonics for next generation transceiver applications are outlined in terms of raw bandwidth, channel capacity, reach, power, cost, link performance and reliability. The advantages for future integration with host chips area also discussed.

Silicon photonic integrated circuits

This paper reviews the CMOS photonics technology developed and commercialized by Luxtera. IC design and CMOS integration methodologies are highlighted and the performance of Luxteras newest 4×14Gbps and 4×25Gbps transceiver chips is discussed.

Silicon photonics for high data rate optical interconnect

CMOS integration methodologies, design and performance of advanced silicon photonics ICs are highlighted. The roadmap towards low power and high density optical interconnect as well as close integration with ASICs are addressed.

Silicon photonics multicore transceivers

We examine how the continued increase of single channel data rates combined with spatial multiplexing enabled by multi-core fibers will lead to the aggressive scaling of the aggregate bandwidth of silicon photonics transceivers.

Silicon-photonics-based optical transceivers for high-speed interconnect applications

In this paper we discuss design and characterization of silicon-photonics-based 100 Gbps (4×26 Gbps) transceivers for parallel single mode fiber communication. We also address some key underlying technologies including silicon photonics wafer processing, photonic device libraries, light source integration and packaging technologies.