Michael Melzl | Researchain

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Featured researches published by Michael Melzl.

IEEE Transactions on Semiconductor Manufacturing | 2008

Last Metal Copper Metallization for Power Devices

Werner Robl; Michael Melzl; Berngard Weidgans; Renate Hofmann; Matthias Stecher

High current-carrying capacity and low resistivity are key parameters for power devices. In this paper a copper based terminal metallurgy scheme for wire- and wedge-bonding is described, which improves these properties. The method of choice for depositing thick copper wires is pattern plating. However the plating process has to be optimized in order to get a homogeneous thickness distribution. An electroless coating of NiP, Pd and Au on top of the Cu layers is used as bond interface. This process provides high reliable gold-wire and aluminum-wedge bonds.

Archive | 2005

Method for machining a workpiece on a workpiece support

Stephen Bradl; Walther Grommes; Werner Kröninger; Michael Melzl; Josef Schwaiger; Thilo Stache

Archive | 2000

Method for treatment of semiconductor substrates

Josef Schwaiger; Gerhard Niederhofer; Gerhard Ott; Michael Melzl

Archive | 2010

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

Markus Hammer; Guenther Ruhl; Andreas Strasser; Michael Melzl; Reinhard Goellner; Doerthe Groteloh

Archive | 2001

Electronic component and utilization of a guard structure contained therein

Heinz Opolka; Paul-Werner Von Basse; Thomas Scheiter; Rainer Grossmann; Christian Peters; Reinhard Fischbach; Andreas Gaymann; Thomas Rosteck; Domagoj Siprak; Thorsten Sasse; Reinhard Göllner; Justin Bierner; Michael Melzl; Klaus Hammer; Markus Witte

Archive | 2006

Semiconductor device and method for producing a semiconductor device

Thomas Gutt; Drik Siepe; Thomas Laska; Michael Melzl; Matthias Stecher; Roman Roth

Archive | 2006

Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium

Stephan Bradl; Michael Melzl; Josef Schwaiger; Thilo Stache

Archive | 2006

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

Thomas Gutt; Dirk Siepe; Thomas Laska; Michael Melzl; Matthias Stecher; Roman Roth

Archive | 2006

Semiconductor component has metal layer comprising coherent section, and other metal layer is arranged on coherent section of former metal layer, where latter metal layer is structured between layered regions

Thomas Gutt; Thomas Laska; Michael Melzl; Roman Roth; Dirk Siepe; Matthias Stecher

Archive | 2000

Electronic component and use of a protective structure contained therein

Heinz Opolka; Basse Paul-Werner Von; Thomas Scheiter; Rainer Grossmann; Christian Peters; Reinhard Fischbach; Andreas Gaymann; Thomas Rosteck; Domagoj Siprak; Thorsten Sasse; Reinhard Göllner; Justin Bierner; Michael Melzl; Klaus Hammer; Markus Witte

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