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Featured researches published by Mikio Nishio.


The Japan Society of Applied Physics | 1996

CMP with Pad-Press Ring for Superior Uniformity Performance

Mikio Nishio; Tomoyasu Murakami; Masashi Hamanaka

We have studied a CMP system with a ring-shaped pressure plate, called Pad-Press Ring ( PPR ), to control the pad-profile during polishing. PPR works as an excellent iz-silz pad-profile controller and improves the polishing uniformity drastically. This system does not need the complicated ex-sinpaA-ptofile control, using the conventional film-backed carrier, two-layered pad, and fumed silica slurry. The non-uniformity of 6Yo calculated by ( Max-Min )+( 2 X Average ) is obtained with a wafer-edgo exclusion lenglh of 5 mm.


Archive | 1995

Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device

Masayuki Endo; Akemi Kawaguchi; Mikio Nishio; Shin Hashimoto


Archive | 1996

Method and apparatus for polishing semiconductor substrate

Tomoyasu Murakami; Mikio Nishio


Archive | 1997

Polishing method and polishing apparatus

Mitsunari Satake; Mikio Nishio; Tomoyasu Murakami


Archive | 1996

Apparatus for holding substrate to be polished and apparatus and method for polishing substrate

Mikio Nishio


Archive | 1991

Semiconductor device and a method of producing the same

Chiaki Kudoh; Akito Uno; Mikio Nishio


Archive | 1997

Apparatus for polishing substrate using resin film or multilayer polishing pad

Mikio Nishio


Archive | 1999

Polishing pad for semiconductor wafer and method for polishing semiconductor wafer

Mikio Nishio; Tomoyasu Murakami


Archive | 1995

ELECTROLESS PLATING BATH USED FOR FORMING WIRING OF SEMICONDUCTOR DEVICE AND WIRING FORMING METHOD FOR THE SAME

Masataka Endo; Shin Hashimoto; Akemi Kawaguchi; Mikio Nishio; 明実 川口; 伸 橋本; 幹夫 西尾; 政孝 遠藤


Archive | 1993

Metal film deposition apparatus and metal film deposition method

Toyokazu Fujii; Mikio Nishio; Mitsuru Sekiguchi; Kazuhiko Hashimoto

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