Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Tomoyasu Murakami is active.

Publication


Featured researches published by Tomoyasu Murakami.


The Japan Society of Applied Physics | 1996

CMP with Pad-Press Ring for Superior Uniformity Performance

Mikio Nishio; Tomoyasu Murakami; Masashi Hamanaka

We have studied a CMP system with a ring-shaped pressure plate, called Pad-Press Ring ( PPR ), to control the pad-profile during polishing. PPR works as an excellent iz-silz pad-profile controller and improves the polishing uniformity drastically. This system does not need the complicated ex-sinpaA-ptofile control, using the conventional film-backed carrier, two-layered pad, and fumed silica slurry. The non-uniformity of 6Yo calculated by ( Max-Min )+( 2 X Average ) is obtained with a wafer-edgo exclusion lenglh of 5 mm.


Archive | 1996

Method and apparatus for polishing semiconductor substrate

Tomoyasu Murakami; Mikio Nishio


Archive | 1997

Polishing method and polishing apparatus

Mitsunari Satake; Mikio Nishio; Tomoyasu Murakami


Archive | 1993

Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture

Kousaku Yano; Masayuki Endo; Yuka Terai; Noboru Nomura; Tomoyasu Murakami; Tetsuya Ueda; Satoshi Ueda


Archive | 1994

Method for forming a multi-layer metallic wiring structure

Tetsuya Ueda; Kousaku Yano; Tomoyasu Murakami; Michinari Yamanaka; Shuji Hirao; Noboru Nomura


Archive | 2006

Dry etching method, fine structure formation method, mold and mold fabrication method

Hideo Nakagawa; Masaru Sasago; Tomoyasu Murakami


Archive | 1996

Method of preventing diffusion between interconnect and plug

Tomoyasu Murakami; Kousaku Yano


Archive | 1992

Method of preventing the corrosion of metallic wirings

Tomoyasu Murakami; Michinari Yamanaka; Kousaku Yano; Masayuki Endo; Noboru Nomura; Staoshi Ueda; Naoto Matsuo; Hiroshi Imai; Masafumi Kubota


Archive | 1999

Polishing pad for semiconductor wafer and method for polishing semiconductor wafer

Mikio Nishio; Tomoyasu Murakami


Archive | 1997

Apparatus for holding substrate to be polished

Tomoyasu Murakami; Mikio Nishio; Mitsunari Satake

Collaboration


Dive into the Tomoyasu Murakami's collaboration.

Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar

Masaru Sasago

Osaka Prefecture University

View shared research outputs
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Researchain Logo
Decentralizing Knowledge