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Mill-Jer Wang

TSMC

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Publication

Featured researches published by Mill-Jer Wang.

Archive | 2011

TEST STRUCTURES FOR THROUGH SILICON VIAS (TSVs) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC)

Hung-Chih Lin; Mill-Jer Wang; Ching-Nen Peng; Hao Chen

Archive | 2011

3D IC testing apparatus

Mill-Jer Wang; Chih-Chia Chen; Hung-Chih Lin; Ching-Nen Peng; Hao Chen

Archive | 2011

Interposers of 3-dimensional integrated circuit package systems and methods of designing the same

Sandeep Kumar Goel; Mill-Jer Wang; Chung-Sheng Yuan; Thomas Chen; Chin-Chou Liu; Yun-Han Lee

Archive | 2011

Probe cards for probing integrated circuits

Mill-Jer Wang; Ching-Nen Peng; Hung-Chih Lin; Hao Chen

Archive | 2008

Wafer level test probe card

Clinton Chao; Fei-Chieh Yang; Chun-Hsing Chen; Mill-Jer Wang; Sheng-Hsi Huang; Ming-Cheng Hsu

Archive | 2011

TEST PROBING STRUCTURE

Mill-Jer Wang; Ching-Fang Chen; Sandeep Kumar Goel; Chung-Sheng Yuan; Chin-Chou Liu; Yun-Han Lee; Hung-Chih Lin

Archive | 2016

THREE DIMENSIONAL INTEGRATED CIRCUIT ELECTROSTATIC DISCHARGE PROTECTION AND PREVENTION TEST INTERFACE

Mill-Jer Wang; Ching-Nen Peng; Hung-Chih Lin; Hao Chen

Archive | 2014

TEST-YIELD IMPROVEMENT DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME

Mill-Jer Wang; Ching-Nen Peng; Hung-Chih Lin; Wei-Hsun Lin; Sen-Kuei Hsu; De-jian Liu

Archive | 2009

Method and system of testing a semiconductor device

Han-Ping Pu; Mill-Jer Wang

Archive | 2014

Apparatus for three dimensional integrated circuit testing

Mill-Jer Wang; Ching-Nen Peng; Hung-Chih Lin; Hao Chen; Chung-Han Huang; Chung-Sheng Yuan; Ching-Fang Chen; Wen-Wen Hsieh; Meng-Lin Chung

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Collaboration

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Hung-Chih Lin

TSMC

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Hao Chen

TSMC

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Ching-Nen Peng

TSMC

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Chung-Han Huang

TSMC

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Chung-Sheng Yuan

TSMC

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Sandeep Kumar Goel

TSMC

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Yun-Han Lee

TSMC

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Chin-Chou Liu

TSMC

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Ching Nen Peng

TSMC

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Ching-Fang Chen

TSMC

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