Mitsuo Yamazaki
Hitachi
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Publication
Featured researches published by Mitsuo Yamazaki.
electronic components and technology conference | 1997
Shinji Takeda; Thkashl Masuko; Yasuo Miyadera; Mitsuo Yamazaki; Iwao Maekawa
Silver paste is the die bonding adhesive most widely used to attach semiconductor silicon chips to metal lead frames in plastic packages. However the increased integration of semiconductor devices and size-expansion of chips has led to the emergence a number of problems with the current adhesives, one of which is insufficient resistance to package cracking during reflow soldering. We have developed therefore a die bonding adhesive film to address these issues. Study of relations between adhesive film composition and those properties resulted in the composition featuring high peel strength and low moisture absorption. A novel die bonding adhesive-silver filled film DF-335-was capable of attaching at low temperature, low pressure and short time. This film showed excellent resistance to package cracking during reflow soldering.
Archive | 1987
Mitsuo Yamazaki; Iwao Maekawa
Archive | 1982
Mitsuo Nakatani; Mitsuo Yamazaki; Masaaki Okunaka; Ryoichi Sudo; Kenji Tochigi; Hitoshi Yokono
Archive | 1980
Ryoichi Sudo; Masaaki Okunaka; Hitoshi Yokono; Tokio Isogai; Mitsuo Yamazaki
Archive | 2005
Yuji Hasegawa; Tooru Kikuchi; Satoshi Ebana; Yasuhisa Odagawa; Masao Kawasumi; Mitsuo Yamazaki
Archive | 1993
Takashi Masuko; Yasuo Miyadera; Shinji Takeda; Mitsuo Yamazaki; Masami Yusa; 崇 増子; 康夫 宮寺; 充夫 山崎; 信司 武田; 正己 湯佐
Archive | 2001
Mitsuo Yamazaki; Minoru Yonezawa; 充夫 山崎; 実 米澤
Archive | 1993
Nobuo Ichimura; Mitsuo Yamazaki; Kohei Fujita; Hidetaka Satou; Yasuo Miyamoto; Masao Kawasumi; Tohru Kikuchi
Archive | 1995
Masami Yusa; Shinji Takeda; Takashi Masuko; Yasuo Miyadera; Mitsuo Yamazaki
Archive | 1980
Masaaki Okunaka; Ryoichi Sudo; Hitoshi Yokono; Tokio Isogai; Mitsuo Yamazaki
