Iwao Maekawa
Hitachi
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Publication
Featured researches published by Iwao Maekawa.
electronic components and technology conference | 1997
Shinji Takeda; Thkashl Masuko; Yasuo Miyadera; Mitsuo Yamazaki; Iwao Maekawa
Silver paste is the die bonding adhesive most widely used to attach semiconductor silicon chips to metal lead frames in plastic packages. However the increased integration of semiconductor devices and size-expansion of chips has led to the emergence a number of problems with the current adhesives, one of which is insufficient resistance to package cracking during reflow soldering. We have developed therefore a die bonding adhesive film to address these issues. Study of relations between adhesive film composition and those properties resulted in the composition featuring high peel strength and low moisture absorption. A novel die bonding adhesive-silver filled film DF-335-was capable of attaching at low temperature, low pressure and short time. This film showed excellent resistance to package cracking during reflow soldering.
Archive | 1987
Mitsuo Yamazaki; Iwao Maekawa
Archive | 1995
Akio Kotato; Yuusuke Miyamae; Tadaji Satou; Makoto Saitou; Tooru Kikuchi; Akira Kageyama; Shinji Takeda; Takashi Masuko; Masami Yusa; Yasuo Miyadera; Mituo Yamasaki; Iwao Maekawa; Aizou Kaneda
Archive | 2001
Shinji Takeda; Takashi Masuko; Masami Yusa; Tooru Kikuchi; Yasuo Miyadera; Iwao Maekawa; Mitsuo Yamasaki; Akira Kageyama; Aizou Kaneda
Archive | 1978
Iwao Maekawa; Isao Uchigasaki; Noboru Monma
Archive | 1983
Iwao Maekawa; Eiji Omori; Isao Uchigasaki; Hideyuki Tobita; Naoki Yokoyama; Seikichi Tanno; Fumio Nakano; Ren Ito
Archive | 1980
Iwao Maekawa; Daisuke Makino
Archive | 1981
Tsutomu Toyoda; Iwao Maekawa; Hirobumi Izumi; Tadashi Fuzii
Archive | 1978
Noboru Monma; Iwao Maekawa; Tutomu Sarudate; Hidetaka Sato; Isao Uchigasaki
Archive | 1989
Iwao Maekawa; Mitsuo Yamazaki
