Mitsuyasu Matsuo
Mitsubishi
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Publication
Featured researches published by Mitsuyasu Matsuo.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A | 1995
Masatoshi Yasunaga; Shinji Baba; Mitsuyasu Matsuo; Hironori Matsushima; Shin Nakao; Tom Tachikawa
A new flip-chip-like package named chip scale package (CSP) has been developed. It is constructed of LSI chips, thin resin coats, and electrode balls, having no leadframe nor any bonding wires. Wiring conductor patterns were used for electrical connection between internal pads on the die and external electrode balls. Also the transfer-bumping technique was applied for inner bump formation. Finally, solder joint life when mounted onto typical boards was estimated by simulation. >
Archive | 1994
Masatoshi Yasunaga; Shin Nakao; Shinji Baba; Mitsuyasu Matsuo; Hironori Matsushima
Archive | 1999
Masatoshi Yasunaga; Shin Nakao; Shinji Baba; Mitsuyasu Matsuo; Hironori Matsushima
Archive | 1993
Shinji Baba; Mitsuyasu Matsuo; Hirotsugu Matsushima; Shin Nakao; Masatoshi Yasunaga; 伸 中尾; 雅敏 安永; 光恭 松尾; 弘倫 松嶋; 伸治 馬場
international electronics manufacturing technology symposium | 1994
Masatoshi Yasunaga; Shinji Baba; Mitsuyasu Matsuo; R. Matsushima; Shin Nakao; T. Tachikawa
Archive | 2000
Jiro Kitayama; Kyoko Fukumura; Mitsuyasu Matsuo; Toru Sugiyama; Youichi Hisamori
Archive | 2000
Jiro Kitayama; Kyoko Fukumura; Mitsuyasu Matsuo; Toru Sugiyama; Youichi Hisamori
Archive | 2003
Mitsuyasu Matsuo; Sei Sugiura; 勢 杉浦; 光恭 松尾
Archive | 2000
Jiro Kitayama; Kyoko Fukumura; Mitsuyasu Matsuo; Toru Sugiyama; Youichi Hisamori
Archive | 2000
Jiro Kitayama; Kyoko Fukumura; Mitsuyasu Matsuo; Toru Sugiyama; Youichi Hisamori
