Kiyoaki Tsumura

Method for bonding a wire and bonding apparatus

Process of passivating a semiconductor device bonding pad by immersion in O2 or O3 solution

Semiconductor device mounting structure including lead frame and lead plate

Capillary tip for bonding a wire

Method and apparatus for melting a bump by induction heating

Semiconductor device with a copper wires ball bonded to aluminum electrodes

Semiconductor device with copper wire ball bonding

Method of ball bonding to non-wire bonded electrodes of semiconductor devices

Structure of electrode junction for semiconductor device

Method of producing semiconductor device