Nathan Fritz
Georgia Institute of Technology
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Publication
Featured researches published by Nathan Fritz.
Microelectronic Engineering | 2013
Rajarshi Saha; Nathan Fritz; Sue Ann Bidstrup-Allen; Paul A. Kohl
A cost-effective, wafer-level package process for microelectromechanical devices (MEMS) is presented. The movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. A polymer epoxycyclohexyl polyhedral oligomericsilsesquioxanes has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20@mmx400@mm to 300@mmx400@mm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.
IEEE Transactions on Device and Materials Reliability | 2012
Gregory T. Ostrowicki; Nathan Fritz; Raphael Okereke; Paul A. Kohl; Suresh K. Sitaraman
An approach for microfabricating precisely defined spherical 3-D domes through a simple low-temperature polymer reflow process was developed. Release of a thin metal film patterned over the domed structure was accomplished by the removal of the underlying polymer using two different methods: dry thermal decomposition and wet supercritical release. The domed shape impacted the effect of stiction during the release step and assisted in the release of large millimeter-size film geometries. The dome and release procedures were used to fabricate an experimental test specimen that functions as either a tensile or interfacial fracture test for thin films on rigid substrates. Other potential applications of the domed metal structures such as compliant electrical interconnects are discussed.
electronic components and technology conference | 2010
Rajarshi Saha; Nathan Fritz; Sue Ann Bidstrup-Allen; Paul A. Kohl
Air-gap structures are of interest in a range of microelectronic applications especially in microelectromechanical systems (MEMS). In this work, we investigate the application of an unique trimaterial for MEMS packaging composed of polypropylene carbonate (PPC) as a sacrificial material, a photosensitive, hybrid inorganic/organic dielectric epoxycyclohexyl polyhedral oligomeric silsesquioxanes (POSS) as the overcoat material, and Al/Cr-Cu thin metal film as a hermetic seal. POSS was used both for patterning the PPC over the structures as well as a stable overcoat material thus reducing the complexity of the fabrication process. A wide range of device sizes and structures (from 20 × 100 µm to 600 × 1000 µm) were fabricated and the processing protocol was found to be compliant over these size/structure variations. Metal adhesion on the overcoat was substantially improved by using low power oxygen plasma for short durations. Cavity-strength was evaluated for different metals and thicknesses. An increase of 5.6 times in cavity-strength was observed for a thicker (3X) Al metal film. Current work is focused on implementing the wafer-level air-cavity package into a lead frame packaged MEMS device through injection and compression molding techniques.
Journal of The Electrochemical Society | 2012
Nathan Fritz; Hyo-Chol Koo; Zachary Wilson; Erdal Uzunlar; Zhongsheng Wen; Xinyi Yeow; Sue Ann Bidstrup Allen; Paul A. Kohl
International Journal of Adhesion and Adhesives | 2012
Nathan Fritz; Huy Dao; Sue Ann Bidstrup Allen; Paul A. Kohl
Journal of Electronic Materials | 2010
Nathan Fritz; Rajarshi Saha; Sue Ann Bidstrup Allen; Paul A. Kohl
Microelectronic Engineering | 2011
Venmathy Rajarathinam; Nathan Fritz; Sue Ann Bidstrup Allen; Paul A. Kohl
Archive | 2010
Nathan Fritz; Paul A. Kohl; Raharshi Saha
Meeting Abstracts | 2011
Nathan Fritz; Sue Ann Bidstrup Allen; Paul A. Kohl
Meeting Abstracts | 2011
Nathan Fritz; Rajarshi Saha; Sue Ann Bidstrup Allen; Paul A. Kohl