Neil A. Ives

Unpinning of the Fermi level on GaAs by flowing water

Unpinning of the Fermi level on GaAs (100) surfaces by photochemical reactions resulting from simultaneous exposure of specimens to flowing water and light was recently reported. We discuss here a series of experiments carried out to provide further information on the changes in surface electronic structure responsible for unpinning of the Fermi level under these conditions. The present work supports the conclusion that the surface states which pin the Fermi level are associated with elemental arsenic and arsenic sesquioxide (As2O3). Effects of each of these two species on pinning are distinguished experimentally. We find that, in addition to photochemical reactions, exposure to flowing water alone can result in Fermi level unpinning under certain conditions. The oxygen content of the wash water and the specimen preparation are shown to be important variables.

In/Pt ohmic contacts to GaAs

Graded heterojunction InGaAs ohmic contacts to GaAs have been prepared which show improved electrical and mechanical properties. The improvements result from the use of a thin Pt layer between the In layer and the substrate which controls the reaction of the In and the GaAs. Evidence is also offered that the InAs heterojunction regions are epitaxial.

Imaging of polydiacetylene on graphite by scanning tunneling microscopy

Scanning tunneling microscopy has been applied to obtain atomically resolved images of polydiacetylene on graphite and to observe hydrogen bonding between polymers directly. Polydiacetylenes have a pseudo‐one‐dimensional conjugated pi‐electron system which gives rise to nonlinear optical behavior of both fundamental and practical significance. Under low surface coverage, the images show a single polymer of CH3(CH2)11—C≡C—C≡C—(CH2)8—COOH. At high coverage, the images show a well‐ordered monolayer of polymers with the nonpolar side groups pointing toward the hydrophobic graphite surface. The spatial electron distribution indicates substantial hydrogen bonding between polymers in the plane containing the polar side groups.

Catastrophic Facet and Bulk Degradation in High Power Multi-Mode InGaAs Strained Quantum Well Single Emitters

Extensive investigations by a number of groups have identified catastrophic sudden degradation as the main failure mode in both single-mode and multi-mode InGaAs-AlGaAs strained quantum well (QW) lasers. Significant progress made in performance characteristics of broad-area InGaAs strained QW single emitters in recent years has led to an optical output power of over 20W and a power conversion efficiency of over 70% under CW operation. However, unlike 980nm single-mode lasers that have shown high reliability operation under a high optical power density of ~50MW/cm2, broad-area lasers have not achieved the same level of reliability even under a much lower optical power density of ~5MW/cm2. This paper investigates possible mechanisms that prevent broad-area lasers from achieving high reliability operation by performing accelerated lifetests of these devices and in-depth failure mode analyses of degraded devices with various destructive and non-destructive techniques including EBIC, FIB, and HR-TEM techniques. The diode lasers that we have investigated are commercial MOCVD-grown broad-area strained InGaAs single QW lasers at ~975nm. Both passivated and unpassivated broad-area lasers were studied that yielded catastrophic failures at the front facet and also in the bulk. To investigate the role that generation and propagation of defects plays in degradation processes via recombination enhanced defect reaction (REDR), EBIC was employed to study dark line defects in degraded lasers, failed under different stress conditions, and the correlation between DLDs and stress levels is reported. FIB was then employed to prepare TEM samples from the DLD areas for cross-sectional HR-TEM analysis.

Noncontact laminar‐flow polishing for GaAs

Laminar‐flow polishing is a noncontact polishing technique capable of producing a highly polished surface with no subsurface mechanical damage. The method utilizes the hydrodynamic condition of laminar flow to provide the transport mechanisms responsible for the removal of the GaAs surface. The method is well suited to the preparation of semiconductor wafers for experiments where high‐quality damage‐free substrates are required. In addition, the ease of controlling the polishing conditions makes this method a useful technique in production where a high throughput of wafers with uniform and damage‐free surfaces are essential.

Root cause investigation of catastrophic degradation in high power multi-mode InGaAs-AlGaAs strained quantum well lasers

Optimization of broad-area InGaAs-AlGaAs strained-quantum-well lasers has led to successful demonstration of high power and high efficient operation for industrial applications. State-of-the-art broad-area single emitters show an optical output power of over 20W and a power conversion efficiency of over 70% under CW operation. However, understanding of long-term reliability and degradation processes of these devices is still poor. This paper investigates the root causes of catastrophic degradation in broad-area lasers by performing accelerated lifetests of these devices and failure mode analyses of degraded devices using various techniques. We investigated MOCVDgrown broad-area strained InGaAs-AlGaAs single QW lasers at ~975nm. Our study included both passivated and unpassivated broad-area lasers that yielded catastrophic failures at the facet and also in the bulk. Our accelerated lifetests generated failures at different stages of degradation by forcing them to reach a preset drop in optical output power. Deep-level-transient-spectroscopy (DLTS) was employed to study deep traps in degraded devices. Trap densities and capture cross-sections were estimated from a series of degraded devices to understand the role that point defects and extended defects play in degradation processes via recombination enhanced defect reaction. Electron-beam-induced-current (EBIC) was employed to find correlation between dark line defects in degraded lasers and test stress conditions. Time-resolved electroluminescence (EL) was employed to study formation and progression of dark spots and dark lines in real time to understand mechanisms leading to catastrophic facet and bulk degradation. Lastly, we present our physics-of-failure-based model of catastrophic degradation processes in these broad-area lasers.

Wide-range fiber-optic strain sensor

A wide-range strain sensor which utilizes optical fiber as the transducing element is reported. This device differs from the well-known microbend type sensor in that a roller chain is used to impose constant curvature bends on the fiber, rather than a corrugated plate which imposes sinusoidal bends in the microbend sensors. This change also leads to a wide range of sensitivity adjustment and a linear calibration curve.

Physics of failure investigation in high-power broad-area InGaAs-AlGaAs strained quantum well lasers

Continued improvements in broad-area InGaAs-AlGaAs strained quantum well (QW) lasers have led to unprecedented performance characteristics in these lasers including optical output powers of over 20 W and power conversion efficiencies of over 70% under CW operation. Catastrophic optical mirror damage (COMD) is responsible for failures in (Al)GaAs QW lasers, but InGaAs-AlGaAs strained QW lasers with optimized facet passivation predominantly fail by catastrophic optical bulk damage (COBD). Since COBD is relatively a new failure type, it requires physics of failure investigation to understand its root causes and then develop COBD-free lasers for high reliability applications including potential satellite systems. We recently proposed a model for degradation mechanism responsible the COBD process and this paper further investigates the root causes of COBD in the lasers using various failure mode analysis techniques. We investigated reliability and degradation mechanism in MOCVD-grown broad-area InGaAs-AlGaAs strained QW single emitters. During entire accelerated life-tests of the lasers we studied, time resolved electroluminescence (TR-EL) techniques were employed to observe formation of a hot spot and subsequent formation and progression of dark spots and dark lines through windowed n-contacts.

Catastrophic optical bulk damage (COBD) in high power multi-mode InGaAs-AlGaAs strained quantum well lasers

State-of-the-art broad-area InGaAs-AlGaAs strained quantum well (QW) lasers show an optical output power of over 20 W and a power conversion efficiency of over 70% under CW operation. Unlike broad-area (Al)GaAs QW lasers, broad-area InGaAs strained QW lasers show two failure types including facet catastrophic optical damage (COD) and bulk failure. Optimization of facet passivation processes has led to significant reduction in occurrence of facet COD (or COMD), but bulk failure (or COBD) has received little attention although it is crucial to understand degradation processes responsible for COBD and then develop COBD-free lasers for high reliability applications including potential satellite systems. Our group recently proposed a model for the COBD process and this paper further investigates the root causes of COBD in the broad-area lasers. We performed accelerated life-tests of MOCVD-grown broad-area strained InGaAs-AlGaAs single QW lasers at ~975 nm, which predominantly yielded catastrophic bulk failures. We employed various non-destructive techniques to study pre- and post-stressed lasers. Time resolved electroluminescence (TR-EL) was employed to observe formation and progression of dark spots and dark lines through windowed n-contacts during entire life-tests that eventually led to COBD. Deep level transient spectroscopy (DLTS) was employed to investigate trap characteristics in degraded devices at different stages of degradation to study the role that non-radiative recombination centers (NRCs) play in COBD processes. Time resolved photoluminescence (TR-PL) was employed to measure carrier lifetimes from both undamaged and damaged active areas to find correlation between dark line defects in degraded lasers and non-radiative recombination processes.

Three-dimensional failure analysis of high power semiconductor laser diodes operated in vacuum

The damaged region of a semiconductor laser diode that failed in a vacuum environment was analyzed using focused ion beam (FIB) serial sectioning, time-of-flight secondary ion mass spectrometry (ToF-SIMS), high resolution transmission electron microscopy (TEM), electron energy loss spectroscopy (EELS), energy dispersive x-ray spectroscopy (EDS), and nanodiffraction. The FIB nanotomography models and the TEM cross sections show a damage structure extending deep into the core and originating at the diode/antireflective (AR) coating interface. Nanocrystalline gold was detected at this interface using both TEM diffraction and EDS, and the localization of gold along the core at the diode/AR interface was corroborated using 3D ToF-SIMS. A thinning of the AR coating above the failure site was observed by TEM with a corresponding increase in carbon content on the AR surface detected with EELS. It is suggested that failure proceeded by pyrolysis of adsorbed hydrocarbons on the AR coating, which, in the presence of...