Nils G. Weimann

Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures

Carrier concentration profiles of two-dimensional electron gases are investigated in wurtzite, Ga-face AlxGa1−xN/GaN/AlxGa1−xN and N-face GaN/AlxGa1−xN/GaN heterostructures used for the fabrication of field effect transistors. Analysis of the measured electron distributions in heterostructures with AlGaN barrier layers of different Al concentrations (0.15<x<0.5) and thickness between 20 and 65 nm demonstrate the important role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces. Characterization of the electrical properties of nominally undoped transistor structures reveals the presence of high sheet carrier concentrations, increasing from 6×1012 to 2×1013u200acm−2 in the GaN channel with increasing Al-concentration from x=0.15 to 0.31. The observed high sheet carrier concentrations and strong confinement at specific interfaces of the N- and Ga-face pseudomorphic grown heterostructures can be explained as a consequence of interface charges induced by ...

Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures

Two dimensional electron gases in Al x Ga 12x N/GaN based heterostructures, suitable for high electron mobility transistors, are induced by strong polarization effects. The sheet carrier concentration and the confinement of the two dimensional electron gases located close to the AlGaN/GaN interface are sensitive to a large number of different physical properties such as polarity, alloy composition, strain, thickness, and doping of the AlGaN barrier. We have investigated these physical properties for undoped and silicon doped transistor structures by a combination of high resolution x-ray diffraction, atomic force microscopy, Hall effect, and capacitance‐voltage profiling measurements. The polarization induced sheet charge bound at the AlGaN/GaN interfaces was calculated from different sets of piezoelectric constants available in the literature. The sheet carrier concentration induced by polarization charges was determined

Scattering of electrons at threading dislocations in GaN

A model to explain the observed low transverse mobility in GaN by scattering of electrons at charged dislocation lines is proposed. Filled traps along threading dislocation lines act as Coulomb scattering centers. The statistics of trap occupancy at different doping levels are investigated. The theoretical transverse mobility from Coulomb scattering at charged traps is compared to experimental data. Due to the repulsive potential around the charged dislocation lines, electron transport parallel to the dislocations is unaffected by the scattering at charged dislocation lines.

Undoped AlGaN/GaN HEMTs for microwave power amplification

Undoped AlGaN/GaN structures are used to fabricate high electron mobility transistors (HEMTs). Using the strong spontaneous and piezoelectric polarization inherent in this crystal structure a two-dimensional electron gas (2DEG) is induced. Three-dimensional (3-D) nonlinear thermal simulations are made to determine the temperature rise from heat dissipation in various geometries. Epitaxial growth by MBE and OMVPE are described, reaching electron mobilities of 1500 and 1700 cm/sup 2//Ns, respectively, For electron sheet density near 1/spl times/10/sup 13//cm/sup 2/, Device fabrication is described, including surface passivation used to sharply reduce the problematic current slump (dc to rf dispersion) in these HEMTs. The frequency response, reaching an intrinsic f/sub t/ of 106 GHz for 0.15 /spl mu/m gates, and drain-source breakdown voltage dependence on gate length are presented. Small periphery devices on sapphire substrates have normalized microwave output power of /spl sim/4 W/mm, while large periphery devices have /spl sim/2 W/mm, both thermally limited. Performance, without and with Si/sub 3/N/sub 4/ passivation are presented. On SiC substrates, large periphery devices have electrical limits of 4 W/mm, due in part to the limited development of the substrates.

The role of dislocation scattering in n-type GaN films

The lateral transport in GaN films produced by electron cyclotron resonance plasma-assisted molecular beam epitaxy doped n type with Si to the levels of 1015–1020u2009cm−3 was investigated. The room temperature electron mobility versus carrier concentration was found to follow a family of bell-shaped curves consistent with a recently proposed model of scattering by charged dislocations. The mechanism of this scattering was investigated by studying the temperature dependence of the carrier concentration and electron mobility. It was found that in the low carrier concentration region (<1017u2009cm−3), the electron mobility is thermally activated with an activation energy half of that of carrier concentration. This is in agreement with the prediction of the dislocation model.

ALGAN/GAN HETEROSTRUCTURES ON INSULATING ALGAN NUCLEATION LAYERS

A single temperature process using AlGaN nucleation layers has been developed that produces device-quality, GaN-based materials with bilayer step surfaces. The AlGaN nucleation layer is deposited by flow modulation organometallic vapor phase epitaxy at temperatures in excess of 1000u200a°C, where GaN and AlGaN films can be subsequently grown. We have optimized this process on both sapphire and SiC substrates, where the conditions for nucleation are found to be quite different. For growth on SiC, aluminum mole fractions ranging from 6% to 35% result in featureless surfaces. Optimizing the alloy composition and thickness of the nucleation layer on SiC allows the deposition of GaN buffer layers exceeding 5 μm without the formation of cracks. A minimum of 15% aluminum in the nucleation layer is required for smooth growth on sapphire substrates. High room temperature two-dimensional electron gas mobilities of 1575 and 1505 cm2/Vs with sheet charge densities of 1.0×1013 and 1.4×1013u200acm−2 are observed in undoped AlG...

Role of Spontaneous and Piezoelectric Polarization Induced Effects in Group-III Nitride Based Heterostructures and Devices

The wurzite group-III nitrides InN, GaN, and AlN are tetrahedrally coordinated direct band gap semiconductors having a hexagonal Bravais lattice with four atoms per unit cell. As a consequence of the noncentrosymmetry of the wurzite structure and the large ionicity factor of the covalent metal–nitrogen bond, a large spontaneous polarization oriented along the hexagonal c-axis is predicted. In addition, group-III nitrides are highly piezoelectric. The strain induced piezoelectric as well as the spontaneous polarizations are expected to be present and to govern the optical and electrical properties of GaN based heterostructures to a certain extent, due to the huge polarization constants which are one of the most fascinating aspects of the nitrides. In this paper we will present theoretical and experimental results demonstrating how polarization induced electric fields and bound interface charges in AlGaN/GaN, InGaN/GaN and AlInN/GaN heterostructures lead to the formation of two-dimensional carrier gases suitable for the fabrication of high power microwave frequency transistors.

Patterning GaN Microstructures by Polarity-Selective Chemical Etching

We have demonstrated GaN microstructures formed by polarity-selective chemical etching in KOH solution. It was found that KOH selectively etches N-polar GaN but not Ga-polar GaN. The polarity-patterned GaN was grown by plasma-assisted molecular beam epitaxy. For intermediate etching times, hexagonal GaN pyramids were formed in the N-polar regions. With prolonged etching, the N-polar GaN can be completely removed. A one-dimensional array of GaN stripes and a two-dimensional array of hexagonal holes formed in a GaN matrix have been fabricated. Extremely smooth vertical sidewalls have been achieved along with an etch depth of up to 4 µm.

Prime Quasientropy and Quasichaos

We construct a prime symmetry relation for integers that is equivalent to Goldbachs conjecture and show that numerical computations of this prime symmetry property strongly resemble a chaotic sequence. We define and examine the notions of global and local prime quasientropies. Finally, we employ the fact that the prime number sequence satisfies the property of deterministic randomness to consider its utility for the field of quantum computation.

Power limits of polarization-induced AlGaN/GaN HEMT's

The present and predicted limits on microwave power performance of undoped AlGaN/GaN HEMTs are presented, based on measured frequency response and drain-source breakdown voltage, both as functions of gate length. The spontaneous and piezoelectric polarization that induce the 2DEG in these HEMTs are covered. Process methods, including Si/sub 3/N/sub 4/ passivation are included. Thermal simulation results are shown for heat dissipation that limits channel temperature to 300/spl deg/C. Microwave cw power density limits of 12.5 W/mm at 10 GHz are predicted for class A operation on thick SiC substrates.