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Featured researches published by Noriyuki Taguchi.


IEEE Transactions on Components, Hybrids, and Manufacturing Technology | 1979

Development of the Thick - Film Capacitor and Its Application for Hybrid Circuit Modules

Katsuo Abe; Akira Ikegami; Nobuyuki Sugishita; Noriyuki Taguchi; Tokio Isogai; Ichiro Tsubokawa; Hiroshi Ohtsu

New dielectric pastes with high and low dielectric constants and an advanced passivation system have been developed for highly reliable capacitors and crossovers in thick-film circuit modules. Colloidal magnetite has been found to be a good sintering agent in BaTiO 3 -based high-K dielectric paste, and a crystallized low-K glass paste has been found to be suitable for small capacitors and crossovers. Alloyed Ag/Pd and Ag/PdO have been developed for conducting electrodes, which are compatible with the dielectric materials and the firing process. Physical defects are the critical factors in the glass passivation systems for the reliability because of possible moisture diffusion into the dielectrics. A new two-layered passivation system has been adopted. The capacitor system has been applied to an RF/IF thick-film hybrid module for radio-cassette recorders.


Archive | 1995

Fabrication process of semiconductor package and semiconductor package

Naoki Fukutomi; Yoshiaki Tsubomatsu; Fumio Inoue; Toshio Yamazaki; Hirohito Ohhata; Shinsuke Hagiwara; Noriyuki Taguchi; Hiroshi Nomura


Archive | 1982

Ceramic wiring boards

Tsuyoshi Fujita; Noriyuki Taguchi; Gyozo Toda; Takashi Kuroki; Shoosaku Ishihara


Archive | 1995

Semiconductor package manufacturing method and semiconductor package

Naoki Fukutomi; Yoshiaki Tsubomatsu; Fumio Inoue; Toshio Yamazaki; Hirohito Ohhata; Shinsuke Hagiwara; Noriyuki Taguchi; Hiroshi Nomura


Archive | 1982

Ceramic multilayer circuit board and a process for manufacturing the same

Noriyuki Taguchi; Tsuyoshi Fuzita; Gyozo Toda; Syoosaku Ishihara; Takashi Kuroki; Tatsuhiro Suzuki


Archive | 1991

Rear projection screen and manufacturing method therefor as well as molding die for shaping rear projection screen, overhead projector and projection television set

Takashi Nishiguchi; Masami Masuda; Noriyuki Taguchi


Archive | 2002

SUBSTRATE FOR SEMICONDUCTOR ELEMENT MOUNTING AND SEMICONDUCTOR PACKAGE

Naoki Fukutomi; Shinsuke Hagiwara; Fumio Inoue; Hiroshi Nomura; Hiroto Ohata; Noriyuki Taguchi; Yoshiaki Tsubomatsu; Akio Yamazaki; 文男 井上; 良明 坪松; 洋人 大畑; 聡夫 山崎; 矩之 田口; 直樹 福富; 伸介 萩原; 宏 野村


Archive | 1978

Dielectric paste for thick film capacitor

Katsuo Abe; Noriyuki Taguchi; Nobuyuki Sugishita; Tokio Isogai


Archive | 2004

Manufacturing method for semiconductor package

Naoki Fukutomi; Shinsuke Hagiwara; Fumio Inoue; Hiroshi Nomura; Hiroto Ohata; Noriyuki Taguchi; Yoshiaki Tsubomatsu; Akio Yamazaki; 文男 井上; 良明 坪松; 洋人 大畑; 聡夫 山崎; 矩之 田口; 直樹 福富; 伸介 萩原; 宏 野村


Archive | 1980

Low temperature-sinterable dielectric composition and thick film capacitor using the same

Hirayoshi Tanei; Akira Ikegami; Noriyuki Taguchi; Katsuo Abe; Hiroshi Ohtsu; Tokio Isogai

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