Oh-seong Kwon

Static noise margin of the full DG-CMOS SRAM cell using bulk FinFETs (Omega MOSFETs)

The operational six-transistor SRAM cell was experimentally demonstrated using bulk FinFET CMOS technology. A cell size of 0.79 /spl mu/m/sup 2/ was achieved by 90 nm node technology, with stable operation at 1.2 V using 4 levels of W and Al interconnects. Static noise margin of 280 mV was obtained at V/sub cc/ of 1.2 V. To our knowledge, this represents the first experimental demonstration of a fully integrated bulk FinFET SRAM cell.

Origin of Leakage Paths Driven by Electric Fields in Al‐Doped TiO2 Films

The growth of leakage current paths in Al-doped TiO2 (ATO) films is observed by in situ TEM under negative bias stress. Through systematic HAADF-STEM, STEM-EDS, and STEM-EELS studies, it is confirmed that the electric field-induced growth of the Ru-doped TiO2 phase is the main reason for the ATO films negative leakage.

Performance Impact of a Slower Main Memory: A case study of STT-MRAM in HPC

In high-performance computing (HPC), significant effort is invested in research and development of novel memory technologies. One of them is Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM) --- byte-addressable, high-endurance non-volatile memory with slightly higher access time than DRAM. In this study, we conduct a preliminary assessment of HPC system performance impact with STT-MRAM main memory with recent industry estimations. Reliable timing parameters of STT-MRAM devices are unavailable, so we also perform a sensitivity analysis that correlates overall system slowdown trend with respect to average device latency. Our results demonstrate that the overall system performance of large HPC clusters is not particularly sensitive to main-memory latency. Therefore, STT-MRAM, as well as any other emerging non-volatile memories with comparable density and access time, can be a viable option for future HPC memory system design.