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Featured researches published by Omkar G. Karhade.


IEEE-ASME Transactions on Mechatronics | 2010

Active Control of Microinterferometers for Low-Noise Parallel Operation

Omkar G. Karhade; F. Levent Degertekin; Thomas R. Kurfess

Active control of phase-sensitive interferometric metrology systems is necessary for low noise, high resolution, high bandwidth, and parallel operation. Conventional active control methods have several drawbacks like low SNR, high complexity, and low bandwidth. With the development of micromachined scanning grating interferometers ( muSGIs), high-bandwidth parallel active control of an array of interferometers is feasible. This paper introduces a novel ldquorecurrent-calibration-based active control algorithm.rdquo Utilizing the high-bandwidth integrated electrostatic actuator, this algorithm splits the calibration of the optics and the displacement measurement in time to achieve better noise reduction. The novel algorithm is implemented digitally using a field-programmable gate array on an array of muSGIs simultaneously. Nonlinearity and the limited range of actuation of the electrostatic actuator affect the performance of the active control. It is compensated by using a lookup table and a gain reversal algorithm. A system model is built to design and analyze the control algorithm. A muSGI interferometer setup validates the model and control approach. The control algorithm reduces the vibration noise by 40 dB at low frequencies with a cutoff frequency of 6.5 kHz. The resolution of the muSGI coupled with the control system is measured as 1 times 10-4 nmrms/radic(Hz) .


Archive | 2016

Integrated circuit package with embedded bridge

Ravindranath V. Mahajan; Christopher J. Nelson; Omkar G. Karhade; Feras Eid; Nitin Deshpande; Shawna M. Liff


Archive | 2013

UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN SEMICONDUCTOR PACKAGES

Omkar G. Karhade; Nitin Deshpande; Rajendra C. Dias; Edvin Cetegen; Lars D. Skoglund


Archive | 2015

METHODS FOR HIGH PRECISION MICROELECTRONIC DIE INTEGRATION

Aleksandar Aleksov; Ravindranath V. Mahajan; Omkar G. Karhade; Nitin Deshpande


Archive | 2014

DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS

Omkar G. Karhade; Debendra Mallik; Ravindranath V. Mahajan; Amruthavalli P. Alur


Archive | 2016

On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks

Hongjin Jiang; Robert Starkston; Digvijay A. Raorane; Keith D. Jones; Ashish Dhall; Omkar G. Karhade; Kedar Dhane; Suriyakala Ramalingam; Li-Sheng Weng; Robert F. Cheney; Patrick N. Stover


Archive | 2013

Flexible electronic assembly and method

Sasha N. Oster; Robert L. Sankman; Charles Gealer; Omkar G. Karhade; John S. Guzek; Ravi Mahajan; James C. Matayabas; Johanna M. Swan; Feras Eid; Shawna M. Liff; Timothy McIntosh; Telesphor Kamgaing; Adel Elsherbini; Kemal Aygun


Archive | 2014

Fließverhalten von Unterfüllmaterial für reduzierte Abstände zwischen den Chiplagen in Halbleiterpaketen

Omkar G. Karhade; Nitin Deshpande; Rajendra C. Dias; Edvin Cetegen; Lars D. Skoglund


Archive | 2014

Picture frame stiffeners for microelectronic packages

Yoshihiro Tomita; Jiro Kubota; Omkar G. Karhade; Shawna M. Liff; Kinya Ichikawa; Nitin Deshpande


Archive | 2013

Electronic device with solder pads including projections

Omkar G. Karhade; Nitin Deshpande

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