Patrick Polakowski

Impact of different dopants on the switching properties of ferroelectric hafniumoxide

The wake-up behavior of ferroelectric thin film capacitors based on doped hafnium oxide dielectrics in TiN-based metal–insulator–metal structures is reported. After field cycling a remanent polarization up to 40 µC/cm2 and a high coercive field of about 1 MV/cm was observed. Doping of HfO2 by different dopants with a crystal radius ranging from 54 pm (Si) to 132 pm (Sr) was evaluated. In all cases, an improved polarization–voltage hysteresis after wake-up cycling is visible. For smaller dopant atoms like Si and Al stronger pinching of the polarization hysteresis appeared with increasing dopant concentration and proved to be stable during cycling.

Ferroelectric hafnium oxide: A CMOS-compatible and highly scalable approach to future ferroelectric memories

With the ability to engineer ferroelectricity in HfO2 thin films, manufacturable and highly scaled MFM capacitors and MFIS-FETs can be implemented into a CMOS-environment. NVM properties of the resulting devices are discussed and contrasted to existing perovskite based FRAM.

Evidence of single domain switching in hafnium oxide based FeFETs: Enabler for multi-level FeFET memory cells

Recent discovery of ferroelectricity in HfO2 thin films paved the way for demonstration of ultra-scaled 28 nm Ferroelectric FETs (FeFET) as non-volatile memory (NVM) cells [1]. However, such small devices are inevitably sensible to the granularity of the polycrystalline gate oxide film. Here we report for the first time the evidence of single ferroelectric (FE) domain switching in such scaled devices. These properties are sensed in terms of abrupt threshold voltage (VT) shifts leading to stable intermediate VT levels. We emphasize that this feature enables multi-level cell (MLC) FeFETs and gives a new perspective on steep subthreshold devices based on ferroelectric HfO2.

A 28nm HKMG super low power embedded NVM technology based on ferroelectric FETs

We successfully implemented a one-transistor (1T) ferroelectric field effect transistor (FeFET) eNVM into a 28nm gate-first super low power (28SLP) CMOS technology platform using two additional structural masks. The electrical baseline properties remain the same for the FeFET integration and the JTAG-controlled 64 kbit memory shows clearly separated states. High temperature retention up to 250 °C is demonstrated and endurance up to 105 cycles was achieved. The FeFET unique properties make it the best candidate for eNVM solutions in sub-2x technologies for low-cost IoT applications.

Impact of field cycling on HfO 2 based non-volatile memory devices

The discovery of ferroelectricity in HfO2 and ZrO2 based dielectrics enabled the introduction of these materials in highly scalable non-volatile memory devices. Typical memory cells are using a capacitor or a transistor as the storage device. These scaled devices are sensitive to the local structure of the storage material, here the granularity of the dielectric doped HfO2 layer, varying the local ferroelectric properties. Detailed studies are conducted to correlate these structural properties to the electrical performance to further optimize the devices for future applications.