Paul J. Steffan

Automatic recipe adjust and download based on process control window

Dynamic process window control using simulated wet data from current and previous layer data

Dual damascene process using high selectivity boundary layers

Universal alignment marks for semiconductor defect capture and analysis

Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification

Method of defining copper seed layer for selective electroless plating processing

Method of making a density multiplier for semiconductor device manufacturing

Automatic defect classification (ADC) reclassification engine

Semiconductor with increased gate coupling coefficient

Electroless plated semiconductor vias and channels