Peter O’Brien

Flip-chip integration of tilted VCSELs onto a silicon photonic integrated circuit.

In this article we describe a cost-effective approach for hybrid laser integration, in which vertical cavity surface emitting lasers (VCSELs) are passively-aligned and flip-chip bonded to a Si photonic integrated circuit (PIC), with a tilt-angle optimized for optical-insertion into standard grating-couplers. A tilt-angle of 10° is achieved by controlling the reflow of the solder ball deposition used for the electrical-contacting and mechanical-bonding of the VCSEL to the PIC. After flip-chip integration, the VCSEL-to-PIC insertion loss is -11.8 dB, indicating an excess coupling penalty of -5.9 dB, compared to Fibre-to-PIC coupling. Finite difference time domain simulations indicate that the penalty arises from the relatively poor match between the VCSEL mode and the grating-coupler.

Optimal laser welding assembly sequences for butterfly laser module packages

We present an optimal laser welding assembly sequence for butterfly laser packages: 1) initial shift, 2) front welding, 3) rear welding, 4) joint gripper releasing, 5) mechanical fine tuning of horizontal misalignment. This sequence has been optimized significantly by modeling the initial shift and experimental investigations of three assembly sequences. Our results show that misalignment from the Post-Weld-Shift (PWS) can be compensated by accurately estimating the initial shift in the vertical direction. Furthermore, the laser hammering procedure, to compensate for misalignment of the vertical direction, can be eliminated by proper package design. Using only final mechanical tuning for horizontal misalignments, optical coupling efficiencies of 73-99% have been achieved for lasers packaged in butterfly modules.

The how and why of a

Optical Coherence Tomography (OCT) is the fastest growing medical imaging modality with more than

10 optical coherence tomography system

1Bln worth of scans ordered and over

Development of a first-generation miniature multiple reference optical coherence tomography imaging device

400M worth of equipment shipped in 2010, just nine years after its commercialization. It is at various stages of acceptance and approvals for eye care, coronary care and skin cancer care and is spreading rapidly to other medical specialties. Indeed, it is the leading success of translation of biophotonics science into clinical practice. Significant effort is being made to provide sufficient evidence for efficacy across a broad range of applications, but more needs to be done to radically reduce the cost of OCT so that it can spread to underserved markets and address new, fast growing opportunities in mobile health monitoring. Currently, a clinical OCT system ranges in price from ~

Six-beam homodyne laser Doppler vibrometry based on silicon photonics technology

50k to ~

Optimization of PAM-4 transmitters based on lumped silicon photonic MZMs for high-speed short-reach optical links

150k, typically is housed on a bedside trolley, runs off AC power, and requires skilled, extensively trained technicians to operate. The cost, size, and skill level required keep this wonderful technology beyond the reach of mainstream primary care, much less individual consumers seeking to monitor their health on a routine basis outside of typical clinical settings and major urban medical centers. Beyond the first world market, there are 6.5 billion people with similar eye and skin cancer care needs which cannot be met by the current generation of large, expensive, complex, and delicate OCT systems. This paper will describe a means to manufacture a low cost, compact, simple, and robust OCT system, using parts and a configuration similar to a CD-ROM or DVD pickup unit (see figure 1). Essentially, this system—multiple reference OCT (MR-OCT)—is based on the use of a partial mirror in the reference arm of a time domain OCT system to provide multiple references, and hence A-scans, at several depths simultaneously (see figure 2). We have already shown that a system based on this configuration can achieve an SNR of greater than 90 dB, which is sufficient for many medical imaging and biometry applications.

Implementation of a high speed time resolved error detector utilising a high speed FPGA

Abstract. Multiple reference optical coherence tomography (MR-OCT) is a technology ideally suited to low-cost, compact OCT imaging. This modality is an extension of time-domain OCT with the addition of a partial mirror in front of the reference mirror. This enables extended, simultaneous depth scanning with the relatively short scan range of a miniature voice coil motor on which the scanning mirror is mounted. This work details early stage development of the first iteration of a miniature MR-OCT device. This iteration utilizes a fiber-coupled input from an off-board superluminescent diode. The dimensions of the module are 40×57  mm. Off-the-shelf miniature optical components, voice coil motors, and photodetectors are used, with the complexity of design depending on the specific application. The photonic module can be configured as either polarized or nonpolarized and can include balanced detection. The results shown in this work are from the nonpolarized device. The system was characterized through measurement of the input spectrum, axial resolution, and signal-to-noise ratio. Typical B-scans of static and in vivo samples are shown, which illustrate the potential applications for such a technology.

Opto-Electronic Hybrid Integrated Platform for High-Speed Telecom/Datacom Applications: Microwave Design and Optimization

This paper describes an integrated six-beam homodyne laser Doppler vibrometry (LDV) system based on a silicon-on-insulator (SOI) full platform technology, with on-chip photo-diodes and phase modulators. Electronics and optics are also implemented around the integrated photonic circuit (PIC) to enable a simultaneous six-beam measurement. Measurement of a propagating guided elastic wave in an aluminum plate (speed ≈ 909 m/s @ 61.5 kHz) is demonstrated.

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

We demonstrate how to optimize the performance of PAM-4 transmitters based on lumped Silicon Photonic Mach-Zehnder Modulators (MZMs) for short-reach optical links. Firstly, we analyze the trade-off that occurs between extinction ratio and modulation loss when driving an MZM with a voltage swing less than the MZMs Vπ. This is important when driver circuits are realized in deep submicron CMOS process nodes. Next, a driving scheme based upon a switched capacitor approach is proposed to maximize the achievable bandwidth of the combined lumped MZM and CMOS driver chip. This scheme allows the use of lumped MZM for high speed optical links with reduced RF driver power consumption compared to the conventional approach of driving MZMs (with transmission line based electrodes) with a power amplifier. This is critical for upcoming short-reach link standards such as 400Gb/s 802.3 Ethernet. The driver chip was fabricated using a 65nm CMOS technology and flip-chipped on top of the Silicon Photonic chip (fabricated using IMECs ISIPP25G technology) that contains the MZM. Open eyes with 4dB extinction ratio for a 36Gb/s (18Gbaud) PAM-4 signal are experimentally demonstrated. The electronic driver chip has a core area of only 0.11mm2 and consumes 236mW from 1.2V and 2.4V supply voltages. This corresponds to an energy efficiency of 6.55pJ/bit including Gray encoder and retiming, or 5.37pJ/bit for the driver circuit only.