Philippe Helin

Low-Loss Singlemode PECVD Silicon Nitride Photonic Wire Waveguides for 532–900 nm Wavelength Window Fabricated Within a CMOS Pilot Line

PECVD silicon nitride photonic wire waveguides have been fabricated in a CMOS pilot line. Both clad and unclad single mode wire waveguides were measured at λ = 532, 780, and 900 nm, respectively. The dependence of loss on wire width, wavelength, and cladding is discussed in detail. Cladded multimode and singlemode waveguides show a loss well below 1 dB/cm in the 532-900 nm wavelength range. For singlemode unclad waveguides, losses 1 dB/cm were achieved at λ = 900 nm, whereas losses were measured in the range of 1-3 dB/cm for λ = 780 and 532 nm, respectively.

Visible-to-near-infrared octave spanning supercontinuum generation in a silicon nitride waveguide

The generation of an octave spanning supercontinuum covering 488-978 nm (at -30  dB) is demonstrated for the first time on-chip. This result is achieved by dispersion engineering a 1-cm-long Si3N4 waveguide and pumping it with an 100-fs Ti:Sapphire laser emitting at 795 nm. This work offers a bright broadband source for biophotonic applications and frequency metrology.

Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: Application to accelerometers

We present an attractive poly-SiGe thin film packaging and MEM (Micro Electro-Mechanical) platform technology for integrating various packaged MEM devices above standard CMOS. The packages, having cavities as large as 1mm2, make use of pillars designed to withstand subsequent molding during 1st level packaging. Covers on top of the release holes avoid deposition inside the cavity during sealing. Hermeticity is proven in vacuum, air and N2 atmosphere and at different temperatures. Packaged functional accelerometers sealed at a pressure around 1bar, have an equivalent performance in measuring accelerations of about 1g compared to a piezoelectric commercial reference device.

Poly-SiGe-Based MEMS Thin-Film Encapsulation

This paper presents an attractive poly-SiGe thin-film packaging and MEM (microelectromechanical) platform technology for the generic integration of various packaged MEM devices above standard CMOS. Hermetic packages with sizes up to 1 mm2 and different sealed-in pressures ( ~ 100 kPa and ~ 2 kPa) are demonstrated. The use of a porous cover on top of the release holes avoids deposition inside the cavity during sealing, but leads to a sealed-in pressure of approximately 100 kPa, i.e. atmospheric pressure. Vacuum ( ~ 2 kPa) sealing has been achieved by direct deposition of a sealing material on the SiGe capping layer. Packaged functional accelerometers sealed at around 100 kPa have an equivalent performance in measuring accelerations of about 1 g compared to a piezoelectric commercial reference device. Vacuum-sealed beam resonators survive a 1000 h 85°C/85%RH highly accelerated storage test and 1000 thermal cycles between -40°C and 150°C.

Expanding the Silicon Photonics Portfolio With Silicon Nitride Photonic Integrated Circuits

The high index contrast silicon-on-insulator platform is the dominant CMOS compatible platform for photonic integration. The successful use of silicon photonic chips in optical communication applications has now paved the way for new areas where photonic chips can be applied. It is already emerging as a competing technology for sensing and spectroscopic applications. This increasing range of applications for silicon photonics instigates an interest in exploring new materials, as silicon-on-insulator has some drawbacks for these emerging applications, e.g., silicon is not transparent in the visible wavelength range. Silicon nitride is an alternate material platform. It has moderately high index contrast, and like silicon-on-insulator, it uses CMOS processes to manufacture photonic integrated circuits. In this paper, the advantages and challenges associated with these two material platforms are discussed. The case of dispersive spectrometers, which are widely used in various silicon photonic applications, is presented for these two material platforms.

MEMS packaging and reliability: An undividable couple

This paper reviews various approaches to package MEMS, illustrated mainly with examples from imec. Wafer-level or 0-level packaging is mostly dealt with. The role the package plays in achieving the required performance and reliability characteristics is elucidated. Package requirements, such as hermeticity and strength, are named, discussed and illustrated with examples. Considerations of reliability testing are presented. It is made conceivable that vacuum maintenance of tiny MEMS packages is a dominant reliability issue, something not at all obvious to achieve.

Challenges of monolithic integration for SiGe MEMS technology

The paper describes the key challenges of CMOS integrated monolithic MEMS Accelerometer with SiGe MEMS technology combined with TSMC 0.18 μm CMOS technology. The developed SiGe MEMS technology shows ability to integrate above any standard foundry process. This allows us to build the smallest form-factor surface micromachined accelerometer for the consumer application in the range of ±2G. The total area of the Accelerometer including the MEMS structure and CMOS is 1.35 mm × 1.35 mm.