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Phillip Duane Isaacs

IBM

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Publication

Featured researches published by Phillip Duane Isaacs.

Archive | 1993

Solder ball connect pad-on-via assembly process

Phillip Duane Isaacs; Gregg A. Knotts; Miles Frank Swain; Burton A. Towne

Archive | 1995

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

Douglas A. Baska; Darryl John Becker; James D. Bielick; Phillip Duane Isaacs; Michael Lynn Zumbrunnen

Archive | 1998

Column grid array or ball grid array pad on via

Phillip Duane Isaacs; Miles Frank Swain; Connie J. Mathison

Archive | 1999

Small form factor optoelectronic transceivers

Mitchell S. Cohen; David Peter Gaio; William K. Hogan; Phillip Duane Isaacs; Patrick E. McKnite; Miles Frank Swain; Jeannine M. Trewhella

Archive | 2000

Pad-on-via assembly technique

Mark Kenneth Hoffmeyer; Phillip Duane Isaacs

Archive | 1995

Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier

James D. Bielick; Mark Kenneth Hoffmeyer; Phillip Duane Isaacs; Thomas Donald Kidd; David Allen Sluzewski

Archive | 1994

Alignment apparatus and method for placing modules on a circuit board

Phillip Duane Isaacs; Thomas Donald Kidd; Bradley Harlan Redfield; Jeffrey Lynn Stone

Archive | 1996

Circuit card having a large module strain relief and heat sink support

Phillip Duane Isaacs; Miles Frank Swain

Archive | 2004

Venting device for tamper resistant electronic modules

John R. Dangler; Phillip Duane Isaacs; Arvind K. Sinha

Archive | 1995

Apparatus and method to test for known good die

Phillip Duane Isaacs; David Allen Sluzewski; Mark Kenneth Hoffmeyer

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Miles Frank Swain

IBM

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John R. Dangler

IBM

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Mark Kenneth Hoffmeyer

IBM

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David C. Long

IBM

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James A. Busby

IBM

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James D. Bielick

IBM

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Michael T. Peets

IBM

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William L. Brodsky

IBM

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Arvind K. Sinha

IBM

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David Allen Sluzewski

IBM

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