Phillip E. Thompson

Electrical injection and detection of spin-polarized carriers in silicon in a lateral transport geometry

We present the electrical injection, detection, and magnetic field modulation of lateral diffusive spin transport through silicon using surface contacts. Fe∕Al2O3 tunnel barrier contacts are used to create and analyze the flow of pure spin current in a silicon transport channel. Nonlocal detection techniques show that the spin current detected after transport through the silicon is sensitive to the relative orientation of the magnetization of the injecting and detecting contacts. Hanle effect measurements demonstrate that the spin current can be modulated by a perpendicular magnetic field, which causes the spin to precess and dephase in the transport channel.

Room temperature operation of epitaxially grown Si/Si0.5Ge0.5/Si resonant interband tunneling diodes

Resonant interband tunneling diodes on silicon substrates are demonstrated using a Si/Si0.5Ge0.5/Si heterostructure grown by low temperature molecular beam epitaxy which utilized both a central intrinsic spacer and δ-doped injectors. A low substrate temperature of 370 °C was used during growth to ensure a high level of dopant incorporation. A B δ-doping spike lowered the barrier for holes to populate the quantum well at the valence band discontinuity, and an Sb δ-doping reduces the doping requirement of the n-type bulk Si by producing a deep n+ well. Samples studied from the as-grown wafers showed no evidence of negative differential resistance (NDR). The effect of postgrowth rapid thermal annealing temperature was studied on tunnel diode properties. Samples which underwent heat treatment at 700 and 800 °C for 1 min, in contrast, exhibited NDR behavior. The peak-to-valley current ratio (PVCR) and peak current density of the tunnel diodes were found to depend strongly on δ-doping placement and on the annea...

Use of atomic layer epitaxy buffer for the growth of InSb on GaAs by molecular beam epitaxy

A 300 A buffer layer of InSb grown by atomic layer epitaxy at a substrate temperature of 300 °C at the GaAs/InSb interface has been employed to grow epitaxial films of InSb having bulk‐like properties. The reduction of the defects in the top InSb film has been observed with cross‐sectional transmission electron microscopy and channeling Rutherford backscattering spectroscopy. The optimum substrate temperature for the primary InSb layer growth was 420 °C with an atomic flux ratio of Sb to In of 1.4 and a growth rate of 1 μm/h. The best 5‐μm‐thick InSb layers had x‐ray rocking curve widths of 100 s, 77 K n‐type carrier concentrations in the low 1015/cm3 range, and 77 K carrier mobilities greater than 105 cm2/V s. Mesa isolated photodiodes had carrier lifetimes of 20 ns, in comparison to 200 ns observed in bulk InSb having a similar carrier concentration. An unexplained, weak free‐electron spin resonance transition has been observed in these films.

Low-temperature cleaning processes for Si molecular beam epitaxy

Hydrogen‐terminated surface cleaning techniques of silicon substrates were investigated by using x‐ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS), and transmission electron microscopy (TEM). Either a 4% HF dip or an HF‐terminated abbreviated Shiraki clean was used as the cleaning technique. Shiraki‐cleaned samples were grown as control samples. XPS was used to measure the C, O, and F remaining on the surface at various stages of the cleaning/growth process, including after a 1 h bake at 200 °C prior to growth. XPS did not detect a significant difference in the adsorbate concentrations between the baked and unbaked samples. From SIMS, the lowest impurity concentrations at the epitaxial/substrate interface were achieved with the abbreviated Shiraki clean, approximately at the same levels as obtained with the standard Shiraki clean, 1.3×1013, 5.4×1012, 1.6×1010, and 4.2×1011/cm2 for C, O, F, and N, respectively. This was achieved without the 850 °C anneal required to desorb the ...

Damaged-induced isolation in n-type InP by light-ion implantation

Abstract A detailed study of the insulating properties of ion-implantation induced damage in InP has been carried out for H, He, B and Be implantation. For each ion, there was found to be an optimal implantation fluence for the formation of resistive layers. At this fluence, a maximum resistivity of 10 3 to 10 4 Ω·cm was observed. Lower resistivities were observed for higher and lower implantation fluences. The primary anneal stage for the maximum resistivity layers was between 250 and 300°C. Anomalous results were observed for H implantation in that the resistivity observed depends on the test structure geometry. Measurements carried out by contacting the front and back of the damage layer gave resistivity values two orders of magnitude greater than those measured by contacting adjacent points on an epitaxial structure. For all other ions, the results obtained for the two geometries were in good agreement. It has been shown that a conductive layer produced by the proton bombardment of the underlying Fe-doped substrate gives rise to a low resistance shunt in the epitaxial study.

A DIFFUSIONAL MODEL FOR THE OXIDATION BEHAVIOR OF SI1-XGEX ALLOYS

We have developed a kinetic model to describe the oxidation behavior of Si1−xGex alloys during Ge segregation, which compares the Deal–Grove flux of oxidant diffusing through the oxide to the maximum flux of Si diffusing through the Ge-rich layer. This is motivated by thermal oxidation experiments on Si1−xGex alloys (x<0.17) using a fluorine-containing ambient (O2 and 200 ppm of NF3). The fluorine is known to modify point defect generation during oxidation of pure Si toward vacancy production, which is also the case for Ge in Si. We demonstrate that fluorinated oxidation of Si1−xGex enhances the oxidation rate by 25%–40% in the temperature range of 700–800 °C. Oxides formed at these temperatures were SiO2, while those formed at 600 °C exhibited a transition from SiO2 to mixed oxide growth at some point during the very early phase of oxidation, depending on the alloy composition. Consideration of these data suggests that other factors in addition to oxidation temperature must be considered in predicting wh...

Diffusion barrier cladding in Si/SiGe resonant interband tunneling diodes and their patterned growth on PMOS source/drain regions

Si/SiGe resonant interband tunnel diodes (RITDs) employing /spl delta/-doping spikes that demonstrate negative differential resistance (NDR) at room temperature are presented. Efforts have focused on improving the tunnel diode peak-to-valley current ratio (PVCR) figure-of-merit, as well as addressing issues of manufacturability and CMOS integration. Thin SiGe layers sandwiching the B /spl delta/-doping spike used to suppress B out-diffusion are discussed. A room-temperature PVCR of 3.6 was measured with a peak current density of 0.3 kA/cm/sup 2/. Results clearly show that by introducing SiGe layers to clad the B /spl delta/-doping layer, B diffusion is suppressed during post-growth annealing, which raises the thermal budget. A higher RTA temperature appears to be more effective in reducing defects and results in a lower valley current and higher PVCR. RITDs grown by selective area molecular beam epitaxy (MBE) have been realized inside of low-temperature oxide openings, with performance comparable with RITDs grown on bulk substrates.

Tri-state logic using vertically integrated Si-SiGe resonant interband tunneling diodes with double NDR

A vertically integrated npnp Si-based resonant interband tunneling diode (RITD) pair is realized with low-temperature molecular beam epitaxy by stacking two RITDs with a connecting backward diode between them. The current-voltage characteristics of the vertically integrated RITD pair demonstrates two sequential negative differential resistance regions in the forward-biasing condition. Tri-state logic is demonstrated by using the vertically integrated RITDs as the drive and an off-chip resistor as the load.

Surface segregation and structure of Sb-doped Si(100) films grown at low temperature by molecular beam epitaxy

Abstract Sb surface segregation and doping during Si(100) molecular beam epitaxy were studied for growth temperatures of 320–500°C. Surface segregation was analyzed by depth profiling with secondary ion mass spectrometry and the results indicate the existence of several distinct dopant concentration- and temperature-dependent surface segregation regimes: (1) For dilute Sb surface concentrations the measurements reveal a region where bulk and surface concentrations are linearly related, and the surface segregation is described by a constant. However, the experimentally determined temperature dependence of the segregation does not follow simple kinetics theory, and appreciable surface segregation is observed at temperatures ≤ 400°C. (2) At temperatures ≥ 350°C, the surface segregation reaches a maximum for Sb surface concentrations of 0.5 monolayers. (3) For surface concentrations near 1 monolayer, the surface segregation decreases with increasing surface Sb coverage due to dopant interaction within surface and subsurface layers. In cases where films were grown under very high dopant fluxes, we have identified cone-like defects and stacking faults that are the result of the apparent surface concentration exceeding 1 monolayer.

Full-band simulation of indirect phonon assisted tunneling in a silicon tunnel diode with delta-doped contacts

Full-band simulations of indirect, phonon assisted, interband tunneling are used to calculate the current–voltage response of a low-temperature molecular-beam-epitaxy-grown silicon tunnel diode with delta-doped contacts. Electron confinement in the contacts results in weak structure in the current–voltage characteristic. The structure is lost when finite lifetime effects are included. The approach uses the nonequilibrium Green function formalism in a second-neighbor sp3s* planar orbital basis.