Pradip Kumar Roy

System and method for forming a uniform thin gate oxide layer

Gate structure for integrated circuit fabrication

Forming a device dielectric on a deposited semiconductor having sub-layers

Polishing pads from closed-cell elastomer foam

Methods of fabricating an integrated circuit device with composite oxide dielectric

Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP)

CMP system and slurry for polishing semiconductor wafers and related method

Pad for chemical mechanical polishing

Multi-layered titanium nitride barrier structure

Method of determining a trap density of a semiconductor/oxide interface by a contactless charge technique