Sudhanshu Misra

Customized polishing pads for cmp and methods of fabrication and use thereof

Method of passivating copper interconnects in a semiconductor

Silicon carbide barrier layers for porous low dielectric constant materials

Method for making an interconnect layer and a semiconductor device including the same

Chemical mechanical polishing endpoint detection by monitoring component activity in effluent slurry

Customized polish pads for chemical mechanical planarization

Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method

Method of making a semiconductor device with barrier and conductor protection

Synthesis of a functionally graded pad for chemical mechanical planarization

Stress Characterization of Post-CMP Copper Films Planarized Using Novel Low-Shear and Surface-Engineered Pads