R. J. Shul

GaN: Processing, defects, and devices

The role of extended and point defects, and key impurities such as C, O, and H, on the electrical and optical properties of GaN is reviewed. Recent progress in the development of high reliability contacts, thermal processing, dry and wet etching techniques, implantation doping and isolation, and gate insulator technology is detailed. Finally, the performance of GaN-based electronic and photonic devices such as field effect transistors, UV detectors, laser diodes, and light-emitting diodes is covered, along with the influence of process-induced or grown-in defects and impurities on the device physics.

AlGaN/GaN quantum well ultraviolet light emitting diodes

We report on the growth and characterization of ultraviolet GaN quantum well light emitting diodes. The room-temperature electroluminescence emission was peaked at 353.6 nm with a narrow linewidth of 5.8 nm. In the simple planar devices, without any efforts to improve light extraction efficiency, an output power of 13 μW at 20 mA was measured, limited in the present design by absorption in the GaN cap layer and buffer layer. Pulsed electroluminescence data demonstrate that the output power does not saturate up to current densities approaching 9 kA/cm2.

Influence of MgO and Sc2O3 passivation on AlGaN/GaN high-electron-mobility transistors

Unpassivated AlGaN/GaN high-electron-mobility transistors show significant gate lag effects due to the presence of surface states in the region between the gate and drain contact. Low-temperature (100 °C) layers of MgO or Sc2O3 deposited by plasma-assisted molecular-beam epitaxy are shown to effectively mitigate the collapse in drain current through passivation of the surface traps. These dielectrics may have advantages over the more conventional SiNX passivation in terms of long-term device stability.

Ion‐implanted GaN junction field effect transistor

Selective area ion implantation doping has been used to fabricate GaN junction field effect transistors (JFETs). p‐type and n‐type doping was achieved with Ca and Si implantation, respectively, followed by a 1150 °C rapid thermal anneal. A refractory W gate contact was employed that allows the p‐gate region to be self‐aligned to the gate contact. A gate turn‐on voltage of 1.84 V at 1 mA/mm of gate current was achieved. For a ∼1.7 μm×50 μm JFET with a −6 V threshold voltage, a maximum transconductance of 7 mS/mm at VGS=− 2V and saturation current of 33 mA/mm at VGS=0 V were measured. These results were limited by excess access resistance and can be expected to be improved with optimized n+ implants in the source and drain regions.

Inductively coupled plasma etching of GaN

Inductively coupled plasma (ICP) etch rates for GaN are reported as a function of plasma pressure, plasma chemistry, rf power, and ICP power. Using a Cl2/H2/Ar plasma chemistry, GaN etch rates as high as 6875 A/min are reported. The GaN surface morphology remains smooth over a wide range of plasma conditions as quantified using atomic force microscopy. Several etch conditions yield highly anisotropic profiles with smooth sidewalls. These results have direct application to the fabrication of group‐III nitride etched laser facets.

Electrical effects of plasma damage in p-GaN

The reverse breakdown voltage of p-GaN Schottky diodes was used to measure the electrical effects of high density Ar or H2 plasma exposure. The near surface of the p-GaN became more compensated through introduction of shallow donor states whose concentration depended on ion flux, ion energy, and ion mass. At high fluxes or energies, the donor concentration exceeded 1019 cm−3 and produced p-to-n surface conversion. The damage depth was established as ∼400 A based on electrical and wet etch rate measurements. Rapid thermal annealing at 900 °C under a N2 ambient restored the initial electrical properties of the p-GaN.

Wet chemical etching of AlN

Single‐crystal AlN grown on Al2O3 is found to be wet etched by AZ400K photoresist developer solution, in which the active component is KOH. The etching is thermally activated with an activation energy of 15.5±0.4 kcal mol−1, and the etch rate is found to be strongly dependent on the crystalline quality of the AlN. There was no dependence of etch rate on solution agitation or any crystallographic dependence noted, and the etching is selective over other binary group III nitrides (GaN, InN) and substrate materials such as Al2O3 and GaAs.

A Review of Dry Etching of GaN and Related Materials

The characteristics of dry etching of the AlGaInN materials system in different reactor types and plasma chemistries are reviewed, along with the depth and thermal stability of etch-induced damage. The application to device processing for both electronics and photonics is also discussed.

HIGH-DENSITY PLASMA ETCHING OF COMPOUND SEMICONDUCTORS

Inductively coupled plasma (ICP) etching of GaAs, GaP, and InP is reported as a function of plasma chemistry, chamber pressure, rf power, and source power. Etches were characterized in terms of rate and anisotropy using scanning electron microscopy, and root-mean-square surface roughness using atomic force microscopy. ICP etch rates were compared to electron cyclotron resonance etch rates for Cl2/Ar, Cl2/N2, BCl3/Ar, and BCl3/N2 plasmas under similar plasma conditions. High GaAs and GaP etch rates (exceeding 1500 nm/min) were obtained in Cl2-based plasmas due to the high concentration of reactive Cl neutrals and ions generated as compared to BCl3-based plasmas. InP etch rates were much slower and independent of plasma chemistry due to the low volatility of the InClx etch products. The surface morphology for all three materials was smooth over a wide range of etch conditions.

Depth and thermal stability of dry etch damage in GaN Schottky diodes

GaN Schottky diodes were exposed to N2 or H2 inductively coupled plasmas prior to deposition of the rectifying contact. Subsequent annealing, wet photochemical etching, or (NH4)2S surface passivation treatments were examined for their effect on diode current–voltage (I–V) characteristics. We found that either annealing at 750 °C under N2, or removal of ∼500–600 A of the surface essentially restored the initial I–V characteristics. There was no measurable improvement in the plasma-exposed diode behavior with (NH4)2S treatments.