Randy W. Snyder

An FT-IR method for performing dynamic kinetic experiments

A method is shown for the determination of kinetic parameters from dynamic FT-IR experiments. The effect heating rate has on the reproducibility of the calculated activation energy is discussed. The curing of PMDA/ODA polyimide at several heating rates is given as an example.

FT-IR Analysis of High-Temperature Solid-Phase Reactions Using GC-IR Software

A method for following chemical reactions in polymers, using the GC-IR software on an FT-IR spectrometer and a high-temperature thermal cell, is discussed. The method reduces disk access time between the collection of each spectrum, allowing many more data points for kinetic experiments to be collected. The imidization reaction of polyimides above 200°C is given as an example.

Diffuse Reflectance FT-IR Analysis of Rosin Flux-Metal Oxide Interactions

The use of diffuse reflectance Fourier transform-infrared spectroscopy for the analysis of rosin flux residues on metal oxide powders, after exposure to high-temperature soldering conditions, is examined. The flux is shown to solvate some metal ions to form metal-carboxylate salt complexes. The ability of nonactivated rosin flux to remove possible corrosion products of copper-tin/lead solder joint areas is discussed.

Cure monitoring of a photosensitive polymer using the luminescent organometallic complex fac-CIRe(CO)3(4,7-Ph2-phen)

Abstract The organometallic complex fac-CIRe(CO)3(4,7-Ph2-phen) exhibits a bright yellow-orange phosphorescence centred at 576 nm in poly(methyl methacrylate)/trimethylolpropane triacrylate (PMMA/TMPTA) solutions. This luminescence feature is shown to be a useful spectroscopic probe of the acrylate crosslinking reactions in the u.v. photochemical curing of a model PMMA/TMPTA thin film system.

ATR/IR spectroscopic method for following photo-polymer curing

A method for examining the photo-induced polymerization of photoresists and solder masks, at the substrate/photopolymer interface, using attenuated total reflectance (ATR) and infrared spectroscopy is discussed. The method is especially useful for dry film photoresists and gives information concerning cure levels affected by exposure dose and photoresist thickness. The photoprocessing of Vacrel® 8100 series solder mask and Riston® 3100 series photoresists from Dupont are used as examples.

An automated integration routine for FT-IR spectrometers

Abstract An integration routine, written in Pascal, is shown that can automatically choose end points for infrared spectral peak integration. The routine accepts data generated from JCAMP-DX software. This paper includes a listing of the program and shows some of its limitations.

The Use of FT-IR to Characterize Photosensitive Thermosets

Photosensitive polymers are used extensively in the electronics industry to pattern line channels on silicon chips, ceramic substrates, and circuit boards. The photolytic process often requires an ultraviolet light exposure and subsequent bake to produce the required properties, prior to solvent development operations. An in situ FT-IR method was developed to assess the cross-linking reaction induced by UV exposure and investigate the effect of temperature on the overall reaction. The method employs a commercially available heated sample cell holder and an in-house fabricated fiber optic exposure tool. The UV-induced cure reaction was monitored as a function of time. The effect of bake temperature after exposure was also monitored.