Raphaël Boichot

CFD modeling of the high-temperature HVPE growth of aluminum nitride layers on c-plane sapphire: from theoretical chemistry to process evaluation

Abstract This study presents numerical modeling based on a relatively limited number of gas-phase and surface reactions to simulate the growth rate of aluminum nitride layers on AlN templates and c-plane sapphire in a broad range of deposition parameters. Modeling results have been used to design particular experiments in order to understand the influence of the process parameters on the crystal quality of AlN layers grown in a high-temperature hydride vapor-phase epitaxy process fed with NH3, AlCl3, and H2. Modeling results allow to access to very interesting local quantities such as the surface site ratio and local supersaturation. The developed universal model starting from local parameters might be easily transferred to other reactor geometry and process conditions. Among the investigated parameters (growth rate, temperature, local supersaturation, gas-phase N/Al ratio, and local surface site N/Al ratio), only the growth rate/supersaturation or growth rate/temperature relationships exhibit a clear process window to use in order to succeed in growing epitaxial AlN layers on c-plane sapphire or AlN templates. Gas-phase N/Al ratio and local surface site N/Al ratio seem to play only a secondary role in AlN epitaxial growth.

Growth and Characterization of Thick Polycrystalline AlN Layers by HTCVD

Thick polycrystalline AlN layers were grown at low pressure using high temperature chemical vapor deposition (HTCVD). The experimental setup consists of a graphite susceptor heated by an induction coil surrounding a vertical cold wall reactor. The reactants used were ammonia (NH(3)) and aluminum chloride (AlCl(x)) species formed in situ via chlorine (Cl(2)) reaction with high purity aluminum wire. AlN films were deposited on a 55 mm diameter graphite susceptor between 1200 and 1600 degrees C. AlN layers have been characterized by scanning electron microscopy, X-ray diffraction, Raman spectroscopy, and electron backscattered diffraction. The influence of temperature on growth rate, surface morphology, grain size, and crystalline structure is presented. Growth rates of up to 230 mu m/h have been reached. A nonpolar preferred orientation of AlN films is stabilized at a higher temperature. The potential of investigation in this new range of experimental conditions, i.e., high temperature and high growth rate, as well as deposition of nonpolar AlN crystals, is very promising for epitaxial growth and extends the field of applications

Undoped TiO2 and nitrogen-doped TiO2 thin films deposited by atomic layer deposition on planar and architectured surfaces for photovoltaic applications

Undoped and nitrogen doped TiO2 thin films were deposited by atomic layer deposition on planar substrates. Deposition on 3D-architecture substrates made of metallic foams was also investigated to propose architectured photovoltaic stack fabrication. All the films were deposited at 265 degrees C and nitrogen incorporation was achieved by using titanium isopropoxide, NH3 and/or N2O as precursors. The maximum nitrogen incorporation level obtained in this study was 2.9 at. %, resulting in films exhibiting a resistivity of 115 Omega cm (+/-10 Omega cm) combined with an average total transmittance of 60% in the 400-1000 nm wavelength range. Eventually, TiO2 thin films were deposited on the 3D metallic foam template.