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Reiner Schuetz

Bosch

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Publication

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Archive | 1999

Method for connecting electronic components to a substrate, and a method for checking such a connection

Jan Benzler; Albert-Andreas Hoebel; Gerhard Schmidt; Stefan Rupprecht; Thomas Ruzicka; Reiner Schuetz; Jiang Hongquan

Archive | 1999

Heat sink for dissipating heat losses from electronic component has contact surface with component equal in area to that of component surface

Ulrich Goebel; Wolfgang Nuechter; Albert-Andreas Hoebel; Stefan Rupprecht; Andreas Fischer; Ralph Schimitzek; Reiner Schuetz; Hongquan Jiang

Archive | 1996

Electrochemical measuring sensor and method for producing an electrochemical measuring sensor

Karl-Hermann Friese; Werner Gruenwald; Kurt Schmid; Claudio de la Prieta; Gerhard Schneider; Hans-Joerg Renz; Harald Neumann; Uwe Glanz; Stefan Kuschel; Ralf Haug; Manfred Moser; Kurt Bayha; Annette Seibold; Carmen Schmiedel; Reiner Schuetz

Archive | 2009

Control device i.e. internal-combustion engine control device, for motor vehicle, has three electrical modules connected with each other by module-oriented electrical connecting units that exhibit different electrical connection technique

Reiner Schuetz; Matthias Lausmann

Archive | 1998

Composition structure for NOx sensors

Thomas Schulte; Thomas Wahl; Bernd Schumann; Reiner Schuetz; Rainer Waser

Archive | 1997

Force sensor having test deflection device

Wolfgang Golderer; Andreas Reppich; Manfred Moser; Annette Seibold; Reiner Schuetz

Archive | 1998

Process for manufacturing pressure-tight via connections

Manfred Moser; Reiner Schuetz; Annette Seibold

Archive | 1999

Verfahren zur verbindung von elektronischen bauelementen mit einem trägersubstrat sowie verfahren zur überprüfung einer derartigen verbindung

Jan Benzler; Albert-Andreas Hoebel; Gerhard Schmidt; Stefan Rupprecht; Thomas Ruzicka; Reiner Schuetz; Jiang Hongquan

Archive | 2017

ELECTRONIC CIRCUIT UNIT

Gunter Flamm; Heiner Jacobs; Reiner Schuetz; Ahmet Kuecuek; Hans-peter Schroeter; Michael Maercker; Moritz Pfeiffer

Archive | 2001

Production of ring-like solder joint between two components comprises preparing two surfaces, applying solder to surface of one component surface, joining components, and fusing solder to form solder joint

Wolfgang Nuechter; Thomas Ruzicka; Reiner Schuetz

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Manfred Moser

Bosch

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Annette Seibold

Bosch

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Hongquan Jiang

Bosch

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Carmen Schmiedel

Bosch

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Gerhard Schneider

Bosch

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Harald Neumann

Bosch

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Karl-Hermann Friese

Bosch

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Kurt Bayha

Bosch

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Kurt Schmid

Bosch

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Ralf Haug

Bosch

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