Rezaur Rahman Khan

Integrated circuit (IC) package stacking and IC packages formed by same

Interconnect structure and formation for package stacking of molded plastic area array package

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Ball grid array package with patterned stiffener layer

Low Voltage Drop and High Thermal Performance Ball Grid Array Package

Leadframe IC packages having top and bottom integrated heat spreaders

Ball grid array package with multiple interposers

Thermal improvement for hotspots on dies in integrated circuit packages

ENHANCED DIE-DOWN BALL GRID ARRAY AND METHOD FOR MAKING THE SAME

Ball grid array package enhanced with a thermal and electrical connector