Ritika Singh Petersen

Fabrication of Ni stamp with high aspect ratio, two-leveled, cylindrical microstructures using dry etching and electroplating

We describe a process for the fabrication of a Ni stamp that is applied to the microstructuring of polymers by hot embossing. The target devices are microcontainers that have a potential application in oral drug delivery. Each container is a 3D, cylindrical, high aspect ratio microstructure obtained by defining a reservoir and a separating trench with different depths of 85 and 125 µm, respectively, in a single embossing step. The fabrication of the required two leveled stamp is done using a modified DEEMO (dry etching, electroplating and molding) process. Dry etching using the Bosch process and electroplating are optimized to obtain a stamp with smooth stamp surfaces and a positive sidewall profile. Using this stamp, hot embossing is performed successfully with excellent yield and high replication fidelity.