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Dive into the research topics where Robert Skuriat is active.

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Featured researches published by Robert Skuriat.


electronics system integration technology conference | 2010

Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module

Nevil Mattey; Robert Skuriat; Jianfeng Li; Pearl Agyakwa; Paul Evans; C. Mark Johnson

We discuss the mechanical and thermal design of a high temperature pressure-mounted base-plate-less power module for application in a continuous high temperature (150°C) ambient.


international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems | 2009

Modelling of jet-impingement cooling for power electronics

M.J. Rizvi; Robert Skuriat; T. Tilford; C. Bailey; Christopher Mark Johnson; Hua Lu

The use of an innovative jet impingement cooling system in a power electronics application is investigated using numerical analysis. The jet impingement system, outlined by Skuriat et al [1], consists of a series of cells each containing an array of holes. Cooling fluid is forced through the device, forming an array of impingement jets. The jets are arranged in a manner, which induces a high degree of mixing in the interface boundary layer. This increase in turbulent mixing is intended to induce higher Nusselt numbers and effective heat transfer coefficients. Enhanced cooling efficiency enables the power electronics module to operate at a lower temperature, greatly enhancing long-term reliability [2]. The results obtained through numerical modelling deviates markedly from the experimentally derived data. The disparity is most likely due to the turbulence model selected and further analysis is required, involving evaluation of more advanced turbulence models.


Materials Science Forum | 2008

Applications-Based Design of SiC Technology

Nicolas G. Wright; C. Mark Johnson; Alton B. Horsfall; Cyril Buttay; Konstantin Vassilevski; W.S. Loh; Robert Skuriat; Pearl Agyakwa

The adoption of SiC devices as a viable technology depends crucially on maximising the potential advantages of the material. This is best achieved by the adoption of co-design techniques in which the optimisation of the SiC device is performed in parallel to that of the package and the overall application. This paper considers suitable techniques for this co-design and describes new approaches to the development of SiC technology for practical applications.


Microelectronics Reliability | 2013

Degradation of thermal interface materials for high-temperature power electronics applications

Robert Skuriat; Jianfeng Li; Pearl Agyakwa; Nevil Mattey; Paul Evans; Christopher Mark Johnson


2012 7th International Conference on Integrated Power Electronics Systems (CIPS) | 2012

Integrated High Power Modules

C. Mark Johnson; Alberto Castellazzi; Robert Skuriat; Paul Evans; Jianfeng Li; Pearl Agyakwa


Integrated Power Systems (CIPS), 2008 5th International Conference on | 2008

Direct Substrate Cooling of Power Electronics

Robert Skuriat; Christopher Mark Johnson


4th IET International Conference on Power Electronics, Machines and Drives (PEMD 2008) | 2008

Thermal performance of baseplate and direct substrate cooled power modules

Robert Skuriat; Christopher Mark Johnson


european conference on power electronics and applications | 2009

Direct substrate cooling of power electronics

Robert Skuriat; Christopher Mark Johnson


Ieej Transactions on Electrical and Electronic Engineering | 2016

Modular integration of a matrix converter

Adane Kassa Solomon; Robert Skuriat; Alberto Castellazzi; Patrick Wheeler


international symposium on power semiconductor devices and ic s | 2018

Development of a highly integrated 10 kV SiC MOSFET power module with a direct jet impingement cooling system

Bassem Mouawad; Robert Skuriat; Jianfeng Li; C. Mark Johnson; Christina DiMarino

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Jianfeng Li

University of Nottingham

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Pearl Agyakwa

University of Nottingham

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Bassem Mouawad

University of Nottingham

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Paul Evans

University of Nottingham

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Nevil Mattey

University of Nottingham

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