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Dive into the research topics where Robert W. Batz is active.

Publication


Featured researches published by Robert W. Batz.


Archive | 1999

Apparatus for high deposition rate solder electroplating on a microelectronic workpiece

Robert W. Batz; Scot Conrady; Thomas L. Ritzdorf


Archive | 2003

Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces

Robert W. Batz; John M. Pedersen; John L. Klocke; Linlin Chen


Archive | 2003

Electroplating reactor including back-side electrical contact apparatus

Daniel J. Woodruff; Kyle M. Hanson; Robert W. Batz; James T. Kuechmann


Archive | 2004

Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density

Linlin Chen; Lyndon W. Graham; Thomas L. Ritzdorf; Dakin Fulton; Robert W. Batz


Archive | 2001

Submicron metallization using electrochemical deposition

Linlin Chen; Lyndon W. Graham; Thomas L. Ritzdorf; Dakin Fulton; Robert W. Batz


Archive | 2006

Electrolytic copper process using anion permeable barrier

Rajesh Baskaran; Robert W. Batz; Bioh Kim; Thomas L. Ritzdorf; John L. Klocke; Kyle M. Hanson


Archive | 2006

Method for applying metal features onto barrier layers using ion permeable barriers

Rajesh Baskaran; Bioh Kim; Robert W. Batz; Tom Ritzdorf; John L. Klocke; Kyle M. Hanson


Archive | 2006

Electrolytic process using cation permeable barrier

Rajesh Baskaran; Robert W. Batz; Bioh Kim; Tom Ritzdorf; John L. Klocke; Kyle M. Hanson


Archive | 2002

Apparatus and method for thermally controlled processing of microelectronic workpieces

Kyle M. Hanson; Robert W. Batz; Rajesh Baskaran; Nolan Zimmerman; Zhongmin Hu; Gregory J. Wilson; Paul R. McHugh


Archive | 2013

ELECTROPLATING TOOL WITH FEEDBACK OF METAL THICKNESS DISTRIBUTION AND CORRECTION

Todd Egan; Edward W. Budiarto; Robert O. Miller; Abraham Ravid; Bridger Hoerner; Robert W. Batz; Daniel J. Woodruff

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