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Ronald J. Nagahara

LSI Corporation

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Publication

Featured researches published by Ronald J. Nagahara.

Archive | 1997

Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing

Ronald J. Nagahara; Dawn M. Lee

Archive | 1997

Polishing pad surface for improved process control

Ronald J. Nagahara; Dawn M. Lee

Archive | 1999

Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing

Ronald J. Nagahara; Dawn M. Lee

Archive | 2000

Process for planarization of metal-filled trenches of integrated circuit structures by forming a layer of planarizable material over the metal layer prior to planarizing

James J. Xie; Ronald J. Nagahara; Jayanthi Pallinti; Akihisa Ueno

Archive | 1997

Shaping polishing pad to control material removal rate selectively

Ronald J. Nagahara; Dawn M. Lee

Archive | 1998

In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation

Richard S. Osugi; Ronald J. Nagahara; Dawn M. Lee

Archive | 1998

Generating non-planar topology on the surface of planar and near-planar substrates

Richard S. Osugi; Ronald J. Nagahara

Archive | 2001

Process for selective polishing of metal-filled trenches of integrated circuit structures

Ronald J. Nagahara; James J. Xie; Akihisa Ueno; Jayanthi Pallinti

Archive | 1997

Shimming substrate holder assemblies to produce more uniformly polished substrate surfaces

Ronald J. Nagahara; Dawn M. Lee

Archive | 1997

Modified carrier films to produce more uniformly polished substrate surfaces

Ronald J. Nagahara; Dawn M. Lee

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Dawn M. Lee

LSI Corporation

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Jayanthi Pallinti

LSI Corporation

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James J. Xie

LSI Corporation

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Akihisa Ueno

LSI Corporation

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Richard S. Osugi

LSI Corporation

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Samuel V. Dunton

LSI Corporation

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Yan Fang

LSI Corporation

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