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Dawn M. Lee

LSI Corporation

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Publication

Featured researches published by Dawn M. Lee.

Archive | 1997

Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing

Ronald J. Nagahara; Dawn M. Lee

Archive | 1997

Polishing pad surface for improved process control

Ronald J. Nagahara; Dawn M. Lee

Archive | 1997

Apparatus for polishing a substrate at radially varying polish rates

Ron Nagahara; Dawn M. Lee

Archive | 1997

Dual purpose retaining ring and polishing pad conditioner

Ron Nagahara; Dawn M. Lee

Archive | 1999

Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing

Ronald J. Nagahara; Dawn M. Lee

Archive | 1997

Shaping polishing pad to control material removal rate selectively

Ronald J. Nagahara; Dawn M. Lee

Archive | 1998

In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation

Richard S. Osugi; Ronald J. Nagahara; Dawn M. Lee

Archive | 1997

Shimming substrate holder assemblies to produce more uniformly polished substrate surfaces

Ronald J. Nagahara; Dawn M. Lee

Archive | 2000

Process for CMP removal of excess trench or via filler metal which inhibits formation of concave regions on oxide surface of integrated circuit structure

Dawn M. Lee; Jayanthi Pallinti; Weidan Li; Ming-Yi Lee

Archive | 1997

Alignment mark contrast enhancement

Nicholas F. Pasch; Marilyn Hwan; Richard S. Osugi; Colin Yates; Dawn M. Lee; Shumay Dou

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Ronald J. Nagahara

LSI Corporation

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Jayanthi Pallinti

LSI Corporation

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Richard S. Osugi

LSI Corporation

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Ron Nagahara

LSI Corporation

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Colin Yates

LSI Corporation

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Marilyn Hwan

LSI Corporation

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Ming-Yi Lee

LSI Corporation

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Nicholas F. Pasch

LSI Corporation

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Shumay Dou

LSI Corporation

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Weidan Li

LSI Corporation

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