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Rongjun Wang

Applied Materials

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Publication

Featured researches published by Rongjun Wang.

Archive | 2007

Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer

Rongjun Wang; Hua Chung; Xianmin Tang; Jenn Yue Wang; Wei D. Wang; Yoichiro Tanaka; Jick M. Yu; Praburam Gopalraja

Archive | 2007

Resputtered copper seed layer

Xianmin Tang; Arvind Sundarrajan; Daniel C. Lubben; Qian Luo; Tza-Jing Gung; Anantha K. Subramani; Hua Chung; Xinyu Fu; Rongjun Wang; Yong Cao; Jick M. Yu; John C. Forster; Praburam Gopalraja

Archive | 2007

Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch Uniformity and Magnetron Producing Sustained Self Sputtering of Ruthenium and Tantalum

Xianmin Tang; Hua Chung; Rongjun Wang; Tza-Jing Gung; Praburam Gopalraja; Jick M. Yu; Hong Yang

Archive | 2007

Oxidized Barrier Layer

Xianmin Tang; Hua Chung; Rongjun Wang; Praburam Gopalraja; Jick M. Yu; Jenn Yue Wang

Archive | 2008

Selective ruthenium deposition on copper materials

Rongjun Wang; Hua Chung; Jick M. Yu; Praburam Gopalraja

Archive | 2008

Method for ultra-uniform sputter deposition using simultaneous RF and DC power on target

Rongjun Wang; Xianmin Tang; Zhendong Liu; Tza-Jing Gung; Maurice E. Ewert

Archive | 2008

APPARATUS FOR CONTROLLING RADIAL DISTRIBUTION OF PLASMA ION DENSITY AND ION ENERGY AT A WORKPIECE SURFACE BY MULTI-FREQUENCY RF IMPEDANCE TUNING

John C. Forster; Daniel J. Hoffman; John Pipitone; Xianming Tang; Rongjun Wang

Archive | 2013

ALUMINUM-NITRIDE BUFFER AND ACTIVE LAYERS BY PHYSICAL VAPOR DEPOSITION

Mingwei Zhu; Nag B. Patibandla; Rongjun Wang; Vivek Agrawal; Anantha K. Subramani; Daniel Lee Diehl; Xianmin Tang

Archive | 2008

PROCESS FOR SELECTIVE GROWTH OF FILMS DURING ECP PLATING

Jick M. Yu; Wei D. Wang; Rongjun Wang; Hua Chung

Archive | 2008

CONTROL OF EROSION PROFILE ON A DIELECTRIC RF SPUTTER TARGET

John C. Forster; Daniel J. Hoffman; John Pipitone; Xianmin Tang; Rongjun Wang

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Collaboration

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Xianmin Tang

Applied Materials

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Hua Chung

Applied Materials

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Jick M. Yu

Applied Materials

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Praburam Gopalraja

Applied Materials

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John C. Forster

Applied Materials

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Daniel J. Hoffman

Applied Materials

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Jenn Yue Wang

Applied Materials

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John Pipitone

Applied Materials

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Tza-Jing Gung

Applied Materials

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Wei D. Wang

Applied Materials

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