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Xianmin Tang

Applied Materials

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Publication

Featured researches published by Xianmin Tang.

Archive | 2002

Self-ionized and capacitively-coupled plasma for sputtering and resputtering

Praburam Gopalraja; Jianming Fu; Xianmin Tang; John C. Forster; Umesh Kelkar

Archive | 2007

Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer

Rongjun Wang; Hua Chung; Xianmin Tang; Jenn Yue Wang; Wei D. Wang; Yoichiro Tanaka; Jick M. Yu; Praburam Gopalraja

Archive | 2002

Method of depositing a TaN seed layer

Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Peijun Ding

Archive | 2004

Oblique ion milling of via metallization

Praburam Gopalraja; Xianmin Tang; Jianming Fu; Mark A. Perrin; Jean Yue Phillip Wang; Arvind Sundarrajan; Hong Zhang; Jick M. Yu; Umesh Kelkar; Zheng Xu; Fusen Chen

Archive | 2005

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

Peijun Ding; Zheng Xu; Hong Zhang; Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Tony Chiang; Gongda Yao; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara

Archive | 2004

Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith

Tza-Jing Gung; Xianmin Tang; John C. Forster; Peijun Ding; Marc O. Schweitzer; Keith A. Miller; Ilya Lavitsky

Archive | 2007

Resputtered copper seed layer

Xianmin Tang; Arvind Sundarrajan; Daniel C. Lubben; Qian Luo; Tza-Jing Gung; Anantha K. Subramani; Hua Chung; Xinyu Fu; Rongjun Wang; Yong Cao; Jick M. Yu; John C. Forster; Praburam Gopalraja

Archive | 2005

Method of depositing low resistivity barrier layers for copper interconnects

Peijun Ding; Zheng Xu; Hong Zhang; Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Tony Chiang; Gongda Yao; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara

Archive | 2005

Method and apparatus for forming a barrier layer on a substrate

Hong Zhang; Xianmin Tang; Praburam Gopalraja; John C. Forster; Jick M. Yu

Archive | 2007

Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch Uniformity and Magnetron Producing Sustained Self Sputtering of Ruthenium and Tantalum

Xianmin Tang; Hua Chung; Rongjun Wang; Tza-Jing Gung; Praburam Gopalraja; Jick M. Yu; Hong Yang

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Praburam Gopalraja

Applied Materials

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Jick M. Yu

Applied Materials

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John C. Forster

Applied Materials

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Jianming Fu

Applied Materials

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Hong Zhang

Applied Materials

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Peijun Ding

Applied Materials

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Rongjun Wang

Applied Materials

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Tza-Jing Gung

Applied Materials

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Hua Chung

Applied Materials

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Suraj Rengarajan

Applied Materials

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