Ruochen Han

Fractional In Situ Pad Conditioning in Chemical Mechanical Planarization

Abstract Material removal rate, shear force and variance of shear force during copper polishing are studied as a function of pad conditioning scheme: 0% in situ conditioning (i.e., basically the equivalent of ex situ conditioning) and fractional in situ conditioning variants (i.e., conditioning during the first 25, 50, 75 or 100% of the total polish time). Spectral analysis of raw shear force data is employed to help elucidate the fundamental physical phenomena during copper chemical mechanical planarization. Fast Fourier transform is performed to convert the shear force data from time domain into frequency domain. The energy distribution of copper polishing is quantified which sheds light on the effect of fractional in situ pad conditioning. Variance of shear force and spectral analysis indicate that pad micro-texture evolution ceases after 50% fractional conditioning, thereby indicating that in situ conditioning time can be reduced during a given polishing process thus extending pad life. This study shows that a combination of unique spectral fingerprinting and analysis of force variance can be used to monitor the effect of pad conditioning in real time. This work also underscores the importance of real-time detection and non-destructive method to extend pad life and consumable usage during CMP by optimizing the pad conditioning time.

Slurry injection schemes on the extent of slurry mixing and availability during chemical mechanical planarization

In this study, slurry availability and the extent of the slurry mixing (i.e., among fresh slurry, spent slurry, and residual rinse-water) were varied via three different injection schemes. An ultraviolet enhanced fluorescence technique was employed to qualitatively indicate slurry availability and its flow on the pad during polishing. This study investigated standard pad center area slurry application and a slurry injection system (SIS) that covered only the outer half of the wafer track. Results indicated that the radial position of slurry injection and the alteration of fluid mechanics by the SIS played important roles in slurry mixing characteristics and availability atop the pad. Removal rates were found to decrease with slurry availability, while a higher degree of slurry mixing decreased the fraction of fresh slurry and consequently lowered the removal rate. By using a hybrid system (i.e., a combination of slurry injection via SIS and standard pad center slurry application), the polishing process benefited from higher slurry availability and higher fraction of fresh slurry than the conventional pad center slurry application and the shorter SIS, individually. This work underscores the importance of optimum slurry injection geometry and flow for obtaining a more cost-effective and environmentally benign chemical mechanical planarization process.