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Ryan David Lane

Qualcomm

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Publication

Featured researches published by Ryan David Lane.

Archive | 2003

Area array package with non-electrically connected solder balls

Edward Reyes; Ryan David Lane; Tiona Marburger; Tom Gregorich

Archive | 2003

Method for accommodating small minimum die in wire bonded area array packages

Ryan David Lane; Edward Reyes; Mark Veatch; Tom Gregorich

Archive | 2004

Optimized power delivery to high speed, high pin-count devices

Justin Joseph Rosen Gagne; Mark Veatch; Ryan David Lane

Archive | 2014

TOROID INDUCTOR IN REDISTRIBUTION LAYERS (RDL) OF AN INTEGRATED DEVICE

Shiqun Gu; Ryan David Lane; Urmi Ray

Archive | 2013

Connector placement for a substrate integrated with a toroidal inductor

Daeik Daniel Kim; Young Kyu Song; Mario Francisco Velez; Jonghae Kim; Changhan Hobie Yun; Chengjie Zuo; Xiaonan Zhang; Ryan David Lane; Matthew Michael Nowak

Archive | 2014

Metal-insulator-metal (mim) capacitor in redistribution layer (rdl) of an integrated device

Shiqun Gu; Ryan David Lane; Glenn D. Raskin; Shree Krishna Pandey

Archive | 2014

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR IN A SUBSTRATE

Jong-Hoon Lee; Young Kyu Song; Daeik Daniel Kim; Jung Ho Yoon; Uei-Ming Jow; Mario Francisco Velez; Jonghae Kim; Xiaonan Zhang; Ryan David Lane

Archive | 2009

Hybrid package construction with wire bond and through silicon vias

Ratibor Radojcic; Arvind Chandrasekaran; Ryan David Lane

Archive | 2013

DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR

Yue Li; Xiaoming Chen; Zhongping Bao; Charles David Paynter; Xiaonan Zhang; Ryan David Lane

Archive | 2015

Inductor embedded in a package subtrate

Siamak Fazelpour; Charles David Paynter; Ryan David Lane

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Xiaonan Zhang

Qualcomm

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Young Kyu Song

Qualcomm

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Charles David Paynter

Qualcomm

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Aristotele Hadjichristos

Qualcomm

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Daeik Daniel Kim

Qualcomm

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Jonghae Kim

Qualcomm

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Edward Reyes

Qualcomm

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Mario Francisco Velez

Qualcomm

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Milind P. Shah

Qualcomm

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Tom Gregorich

Qualcomm

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