Ryosuke Ishii

Component Technologies for Ultra-High-Voltage 4H-SiC pin Diode

Forward voltage drops of carbon implanted and thermal oxidized pin diode with thick drift layer are investigated to evaluate the effect on the lifetime. The forward voltage drops of the carbon implanted and thermal oxidized pin diodes with drift layer of 120 μm thick were around 4.0 V. Furthermore, blocking characteristics of 4H-SiC pin diodes with mesa-JTE, which were fabricated on C-face and Si-face substrates, are also investigated. The breakdown voltages of pin diodes with 250 μm and 100 μm epitaxial layers are 17.1 kV and 10.9 kV, respectively.

Novel SiC Zener Diodes with High Operating Temperature of 300°C and High Power Density of 40 kW/cm2

This paper reports on the achievement of high-power 4H-SiC Zener diodes which have a high-doped pn junction with a large active area of 4 mm x 4 mm. The temperature coefficient of the breakdown voltage is as small as 5.7x10-5 1/K (positive) in the temperature range 20-300°C. In addition, reverse power capabilities of 6.3 kW (40 kW/cm2) at 20°C and 6.0 kW (38 kW/cm2) at 300°C during rectangular pulsed power operation (tw = 1 ms) have been achieved without device failure.