Ryuta Yamada

Electroluminescence in Metal-Oxide-Semiconductor Tunneling Diodes with Ultra Thin Silicon

Electroluminescence characteristics of a metal-oxidesemiconductor tunneling diode on a silicon-on-insulator wafer have been studied. The spectrum from the diode is peaked at 1050 nm (1.18 eV) and at 1145 nm (1.08 eV). The spectrum from the diode on a silicon wafer is peaked at 1145 nm. The peak at 1145 nm can be assigned as phonon-assisted indirect transitions. It is indicated that the peak at 1050 nm is due to the quantum confinement in an ultra thin silicon layer.

Characterization of Pinhole in Patterned Oxide Buried in Bonded Silicon-on-Insulator Wafers by Near-Infrared Scattering Topography and Transmission Microscopy

Patterned oxides buried in bonded silicon-on-insulator (SOI) wafers before thinning have been characterized by near-IR scattering topography and a microscopy combination system. Micron-scaled pinholes in patterned oxides buried in bonded SOI wafers have been observed by the scattering topography. Edges of the patterned oxides have also been observed by both scattering topography and transmission microscopy. With the combination of scattering topography and transmission and reflection microscopy, this system is effective to evaluate the visibility of patterned oxides buried in bonded SOI wafers.

Characterization of Patterned Oxide Buried in Bonded Silicon-on-Insulator Wafers by Near-Infrared Scattering Topography and Microscopy

A patterned oxide buried in bonded silicon-on-insulator (SOI) wafers before thinning has been characterized using a near-infrared scattering topography system. This system has been combined with transmission and reflection microscopy. The edge of the patterned oxide buried in the SOI wafer has been observed. Micron-scaled oxide disks formed by the focused ion beam technique in stacked SOI structures have been observed by near-infrared scattering topography. A particle has been identified to be located inside a silicon/air/silicon structure by both near-infrared and visible laser scattering topographies. The size of the particle inside the silicon/air/silicon structure has been estimated to be 0.2 µm from the intensity of scattered near-infrared light. This method has an advantage over semiconductor failure analysis in future scaled-down technologies.