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Dive into the research topics where Sang Won Jeong is active.

Publication


Featured researches published by Sang Won Jeong.


Journal of Materials Research | 2002

Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Won Kyoung Choi; Jonghoon Kim; Sang Won Jeong; Hyuck Mo Lee

This study has been supported by the Center for Electronic Packaging Materials (CEPM) of the Korea Science and Engineering Foundation (KOSEF).


Journal of Electronic Materials | 2004

Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging

Sang Won Jeong; Jonghoon Kim; Hyuck Mo Lee


Materials Transactions | 2002

Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications

Jonghoon Kim; Sang Won Jeong; Hyuck Mo Lee


Journal of Electronic Materials | 2002

A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system

Jonghoon Kim; Sang Won Jeong; Hyuck Mo Lee


Journal of Electronic Materials | 2003

Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint

Jonghoon Kim; Sang Won Jeong; Hyun Deuk Kim; Hyuck Mo Lee


Materials Transactions | 2002

Lead-Free Electronics Packaging. Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications.

Jonghoon Kim; Sang Won Jeong; Hyuck Mo Lee


Materials Transactions | 2004

Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface

Jonghoon Kim; Sang Won Jeong; Hyuck Mo Lee


Materials Transactions | 2003

Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Seung Wook Yoon; Jonghoon Kim; Sang Won Jeong; Hyuck Mo Lee


Materials Science Forum | 2003

Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging

Sang Won Jeong; Jae-Seok Kim; Hyuck Mo Lee


Materials Transactions Jim | 2002

Thermodynamics-aided alloy design and evaluation of Pb-free solders for high-temperature applications : Lead-free electronics packaging

Jonghoon Kim; Sang Won Jeong; Hyuck Mo Lee

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Jae-Seok Kim

Dong-A University Hospital

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