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Proceedings., 39th Electronic Components Conference | 1989

Cavity down AlN PGA with inter-polyimide wiring

Hirokazu Inoue; Akira Tanaka; Masahide Okamoto; Hideo Arakawa; Sensuke Okada; Kunpei Yamada

A low-thermal-resistance, high-speed pin-grid-array (PGA) package is discussed. To obtain low thermal resistance, a silicon chip was soldered onto a metallized aluminum nitride ceramic substrate that directly contacts an air-cooled fin (a cavity-down structure). Low propagation delay was realized by placing signal lines between low-dielectric-constant polyimide layers that were coated on the substrate. The thermal resistance from the silicon chip to the air environment was 2.7 degrees C/W with a 20-mm-high fin when the air velocity was 2 m/s. The self-inductance of the longest signal line was 20 nH, and the capacitance between the longest signal lines was 1.7 pF. The helium leakage level was about 10/sup -9/ atm-cm/sup 3//s even after 24 cycles in a thermal cycle test from -55 degrees C to 150 degrees C.<<ETX>>


Archive | 1989

Rollers for rolling mills

Masahisa Sobue; Sensuke Okada; Kimihiko Akahori; Keiichi Kuniya; Toshimi Sasaki; Toshiyuki Kajiwara; Tomoaki Kimura; Mitsuo Nihei


Archive | 1998

Plasma processing apparatus with a dielectric body in the waveguide

Hirofumi Seki; Satoshi Ichimura; Satoshi Takemori; Eiji Setoyama; Kouji Ishiguro; Yasuhiro Mochizuki; Sensuke Okada; Hajime Murakami


Archive | 1997

Circuit board and semiconductor device using the circuit board

Akira Tanaka; Tadao Kushima; Hideo Shimizu; Sensuke Okada; Yoshihiko Koike; Kazuji Yamada; Ryuichi Saito


Archive | 1997

Modular type power semiconductor apparatus

Hirokazu Inoue; Ryoichi Kajiwara; Yoshihiko Koike; Masahiro Koizumi; Shigehisa Kuribayashi; Yasutoshi Kurihara; Tadao Kushima; Kinya Nakatsu; Sensuke Okada; Ryuichi Saito; Hideo Shimizu; Yukio Sonobe; Kazuhiro Suzuki; Akira Tanaka


Archive | 1984

Rolls for rolling mills

Masahisa Sobue; Sensuke Okada; Kimihiko Akahori; Keiichi Kuniya; Toshimi Sasaki; Toshiyuki Kajiwara; Tomoaki Kimura; Mitsuo Nihei


Vacuum | 1998

Development of a locally-electron-heated plasma source for HDP-CVD process

Hirofumi Seki; Y. Ueno; Satoshi Ichimura; Satoshi Takemori; S. Uchikawa; H. Murakamia; Sensuke Okada; Yasuhiro Mochizuki; Eiji Setoyama


Archive | 1997

Schaltungsplatine und Halbleiterbauteil mit dieser Circuit board and semiconductor device with this

Yoshihiko Koike; Tadao Kushima; Sensuke Okada; Ryuichi Saito; Hideo Shimizu; Akira Tanaka; Kazuji Yamada


Archive | 1997

Leistungshalbleiteranordnung in modularer Bauart Power semiconductor device in modular design

Akira Tanaka; Hirokazu Inoue; Tadao Kushima; Yoshihiko Koike; Hideo Shimizu; Ryuichi Saito; Kazuhiro Suzuki; Yasutoshi Kurihara; Sensuke Okada; Masahiro Koizumi; Ryoichi Kajiwara; Yukio Sonobe; Kinya Nakatsu; Shigehisa Kuribayashi


Archive | 1997

Schaltungsplatine und Halbleiterbauteil mit dieser

Yoshihiko Koike; Tadao Kushima; Sensuke Okada; Ryuichi Saito; Hideo Shimizu; Akira Tanaka; Kazuji Yamada

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