Serkan Basat

Integration of sensors and RFID's on ultra-low-cost paper-based substrates for wireless sensor networks applications

In this paper, an overview of novel integration approaches for improved performance UHF radio frequency identification (RFID) tags and embedded sensors and batteries is presented. Organic substrates, such as paper, that have been very rarely used in UHF and RF applications in the past and could potentially utilize inkjet printing techniques, are also thoroughly investigated for the realization of ultra- low-cost RFID/Sensor tags for frequencies ranging from 13.56 MHz up to 950 MHz for the first time ever. The proposed technology could potentially revolutionize wearable and conformal wireless sensor networks (WSN).

Design and development of a miniaturized embedded UHF RFID tag for automotive tire applications

The utilization of UHF radio frequency identification (RFID) tag to monitor the tire history in automotive tire applications is presented. Three novel antenna designs are proposed and comparatively evaluated in terms of efficiency, size, read range limitations, and antenna-IC port matching. A prototype of a low-resistive high-inductive RFID tag antenna that is physically built and embedded in actual tires meets the design specifications of read range of minimum 50 cm, high-reliability in terms of the tire traveling test, and antenna-IC packaging size requirement of 7 cm /spl times/ 3 cm.

Design and development of novel inductively coupled RFID antennas

Inductively coupled RFID antennas in two different structures, namely arc-shape and dual-body configurations, are presented. High input resistance can be easily achieved with these structures to realize conjugate impedance matching with some tag chips. 1.99 dBi and 5.62 dBi directivities at 915 MHz are also observed

Design, Development and Integration of Novel Antennas for Miniaturized UHF RFID Tags

An overview of design requirements and novel approaches for improved performance UHF radio frequency identification (RFID) tags is presented. Two matching techniques, an inductively coupled structure and a serial stub structure are discussed. Different miniaturized antenna topologies are proposed, focusing on low-profile, high efficiency and high directivity in very compact (less than 3 in times 3 in) configurations.

Design and modeling of embedded 13.56 MHz RFID antennas

Radio frequency identification (RFID) tags have become quite widespread in many services. In these applications, data are transferred, contact-free, to a local querying system (reader or interrogator) from a remote transponder (tag) which includes an antenna and a microchip transmitter. A suitable antenna for these tags must have low cost, low profile and, especially, small size, whereas the bandwidth requirement (few kilohertz) is less critical. There has been much interest in the 13.56 MHz frequency in the last decade, more than in the VLF, LF and UHF bands. The use of the 13.56 MHz frequency has proven to be advantageous over these other bands. With the aid of IE3D software, which is based on the method of moments (MoM), a single-layer 13.56 MHz RFID tag has been designed and modeled, and a double-layer design has been developed to reduce size. The antenna challenges, which include port matching, efficiency, and size at 13.56 MHz, and the performance advantages over the UHF band are addressed.

Design and development of novel miniaturized UHF RFID tags on ultra-low-cost paper-based substrates

In this paper, an overview of design requirements and novel approaches for improved performance UHF radio frequency identification (RFID) tags is presented. Two matching techniques, inductively coupled structure and serial stub structure are discussed. Different antenna configurations are proposed, focusing on low-profile, low polarization mismatch and high directivity. Paper substrates, that could potentially utilize inkjet printing techniques, are also investigated for the realization of ultra-low-cost RFID tags.

Integration of sensors and inkjet-printed RFID tags on paper-based substrates for UHF “Cognitive Intelligence” applications

In this paper, an overview of novel design and integration approaches for improved performance UHF Radio Frequency Identification (RFID) tags with embedded power source and sensing capability is presented. Ultra-low-cost organic substrates, such as paper, with inkjet-printing capability are investigated for the UHF frequency band. The proposed technology could potentially revolutionize sensor nodes and RFID tags for various applications such as security, logistics, automotive and pharmaceutical.

Flexible LCP and Paper-based Substrates with Embedded Actives, Passives, and RFIDs

Miniaturization with increased functionality at reduced cost historically has been the key driver for the evolution of electronics products. However, the size reduction was traditionally confined to lateral dimensions, until recently in the 21st century, the real estate in the Z-direction has been severely compromised, therefore, THIN has become the buzz word encompassing thin die, thin dielectric, thin passives, thin core and ultimately leading to thin packages. This paper overviews the trends from thick to thin electronic products, materials, processes, and manufacturing of the thick and thin packages with embedded passive components such as resistors, capacitors, inductors, and lately the Actives. Flexible organics with embedded IC and thin film passive materials and substrates that can perform at frequencies in the range 2-110 GHz has been established with liquid crystal polymers . A roadmap for the realization of highly integrated RPID tags with wireless sensors and thin film batteries on ULTIMATE low-cost synthetic material such as photocopy papers has been addressed. To this regard, special attention is given to miniaturization of antennas and on specific techniques for ultra-high-efficiency (95%) RFIDs. Examples of paper-based conductive Ink-Jet printed circuits as well as copper circuitary by etching have been investigated as a means for further cost reduction including ultra-thin printed batteries and power-scavenging devices, as well as to miniaturized sensors (temperature, chemical, pressure) that would enable long-range ubiquitous sensing. Dielectric constants and dielectric loss measurements on paper-substrates are reported for the first time at frequency >1GHz.

Design of RF and wireless packages using fast hybrid electromagnetic/statistical methods

A method for the design of packaging elements using a combination of electromagnetic simulation and statistical modeling techniques is presented. In this paper, fite-ground coplanar waveguide (FG-CPW) lime coupling is addressed. The electromagnetic performance of two FG-CPW limes in parallel is determined with FDTD. The results of these simulations are analyzed using the design of experiments (DOE) and response surface modeling (RSM) techniques. The result is a statistical model that can he used to determine the lime geomeby based on performance requirements. Introduction Modem RF microsystems require increasingly higher levels of integration to create compact modules that incorporate the maximum amount of functionality. One method of accomplishing this is to place progressively mure circuit components in the package. These components are placed in very close proximity and their interaction is inevitable. Crosstalk and coupling between closely spaced lines can have a catastrophic effect on the performance of a circuit. It is imperative that this coupling he quantified so that its effect can be accounted for in design. One common type of line used in these circuits is the fite-ground coplanar waveguide (FG-CPW)(l). This paper explores the coupling between two finite-ground coplanar waveguides placed in parallel and quantifies the effect based on the circuit parameters using a methodology that integrates simulation and statistical tools. Two identical, parallel, finite-ground coplanar waveguides can he characterized by five parameters, the width of the signal line, the distance between the signal lime and the ground plane, the width of the ground plane, the spacing between the limes, and the height of the substrate. By comparing the performance of configurations generated by varying these parameters, the effect of each parameter can he determined. The number of cases required by varying these parameters can he large and their fabrication can be time consuming and expensive. In order to reduce this, these cases can be supplemented by simulation. By using an accurate simulator, such as the full-wave f~te-difference time-domain technique (FDTD)(Z), which has been shown to effectively model the topology performance in a wide frequency range(l). the parameter variation can he carried out numerically in a significantly quicker and inexpensive way. Statistical techniques can then he applied to the simulation results to develop accurate and highly efficient models that can predict performance based on any combination of parameters in a design space. The hybrid design procedure for this investigation begins with identifying the parameters to be varied and determining the design space, that is, the ranges for the variation. The design space of the parameters has to be chosen such it includes the fabrication value range while providing sufficient variation in performance. In the case of the parallel FG-CPW lines, the parameter of interest is the signal coupled to one line when the other is excited (parasitic crosstalk). The results of these FDlD simulations are then used in design of experiments (DOE)(3) and response surface modeling (RSM)(4) statistical methodologies in order to develop a model that explains the effect of each parameter on the performance of the circuit. This proof of technique is useful in a number of ways. First, it allows the interaction of circuit interconuects used in SOP and SOC geometries to be characterized in terms of their geometrical and material parameters in a swift manner. Furthermore, the technique can he applied to more complex wireless transceiver packages that can be extremely difficult to optimize, even in electromagnetic simulation. This allows the designer to optimize results from highly accurate electromagnetic simulation techniques with powerful statistical methodologies and apply them to highly-integrated RF structures using diakoptics approaches.