Seung-Hwan Shim

41.4: AMOLED based on Silicon-On-Glass (SiOG) Technology

We have demonstrated that the single crystalline silicon films on the glass substrates can be utilized in the conventional mass production lines. The single crystalline Si layers were transferred to the 370 mm × 470 mm glass substrates using Silicon-On-Glass (SiOG) technology. Using the thin film transistor backplanes made by conventional CMOS technology, 2.4″ qVGA AMOLED with integrated circuits were successfully fabricated. A completed 2.4″ qVGA AMOLED module shows wide viewing angle (> 170°) and 73% color gamut. The advantages of SiOG technology and its significances will be presented.

28.3: World's Largest (21.3 in.) UXGA Non‐Laser LTPS AMLCD

We have successfully demonstrated a 21.3-inch UXGA (1600 × RGB × 1200) LTPS AMLCD manufactured by non-laser crystallization method. The gate and data drivers were made of CMOS TFTs. Gate-driver circuits composed of shift registers and buffer circuits were integrated on both sides of panel for dual driving method and the multiplexing circuit was implemented on its data circuits. The non-laser technique such as nanocap-assisted crystallization is promising for low-cost LTPS on glass, compared to conventional laser annealing process.